Direct wafer bonding for encapsulation of fused silica optical gratings

Kalkowski, G.; Zeitner, Uwe D.; Benkenstein, Tino; Fuchs, J.-U.; Rothhardt, Carolin; Eberhardt, Ramona

doi:10.1016/j.mee.2012.04.020

Cited by 19 publications

(12 citation statements)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Hydrophilic wafer bonding of surface oxides or nitrides has now been applied to a number of differing materials such as germanium, 123 fused silica 124 and titanium. 125 While the precise parameters vary for each material, hydrophilic silicon wafer bonding provides a good general model for the bonding process.…”

Section: When Heated Above 800mentioning

confidence: 99%

A Review of Hydrophilic Silicon Wafer Bonding

Masteika

Kowal

Braithwaite

et al. 2014

ECS J. Solid State Sci. Technol.

View full text Add to dashboard Cite

Hydrophilically activated direct wafer bonding is a technique for gluelessly attaching oxide-coated wafers together. This ability is a vital step in the construction of many microelectronic and microelectromechanical (MEMS) devices. In particular this technique is widely used in the production of 3d interconnected devices due to the lack of interlayer. © 2014 The Electrochemical Society. [DOI: 10.1149/2.007403jss] All rights reserved.Manuscript submitted June 5, 2013; revised manuscript received December 9, 2013. Published February 3, 2014 This review covers the key papers relating to the theory, techniques and quantification of hydrophilically activated silicon wafer bonding. This begins with a review of the history and development of the art. Bond strength characterization is then reviewed followed first by models of physical deformation and then by plasma and radical activation techniques.In the interests of clarity and succinctness this review is not an attempt to exhaustively catalog all direct bonding wafer literature. Excluded are hydrophobic and UHV bonding, and the many papers applying bonding techniques to differing combinations of wafer materials. This paper concludes with a summery of the state of the art of direct wafer bonding and a summation of the current wafer-bonding model derived from the papers reviewed. History and Establishment of the Art

show abstract

Section: When Heated Above 800mentioning

confidence: 99%

A Review of Hydrophilic Silicon Wafer Bonding

Masteika

Kowal

Braithwaite

et al. 2014

ECS J. Solid State Sci. Technol.

View full text Add to dashboard Cite

show abstract

“…In our GRISM manufacturing approach, cleaning, plasma activation and contacting proceed in a ISO class 3 clean room environment. Except for contacting, the process sequence is the same as previously described for joining fused silica glass wafers [5]. However, while the latter are transferred into a vacuum device before full area contacting and bonding, this is currently not possible with GRISM manufacturing, due to the bulky nature of the prisms and the single-part production conditions.…”

Section: Icso 2016mentioning

confidence: 99%

“…In view of the grating induced anisotropy, the direction of load impact is chosen in parallel to the groove run, when a structured grating side is involved in bonding. This orientation represents the direction of least bond strength [5,6], due to the reduced contact area that is provided by only the ridges of the binary grating. In the exemplary PGP-testbond, ridge width amounts to about 1/3 of the grating period and breakage occurred neatly at the structured side of the grating element in nearly all cases.…”

Section: Characterization Of Grism Bonds a Bond Strength (Static)mentioning

confidence: 99%

Grism manufacturing by low temperature mineral bonding

Kalkowski

Grabowski

Harnisch

et al. 2017

International Conference on Space Optics — ICSO 2016

Self Cite

View full text Add to dashboard Cite

“…Thus, the mirror was formed beneath the grating, which enhanced the coupling efficiency up to 69%. Some other applications of hydrophilic wafer bonding include the integration of Si photonics and plasmonic waveguides to improve the coupling efficiency [93], the integration of photoluminescence devices on SOI substrates [94], the encapsulation of fused silica optical gratings [95], and the fabrication of heterojunction photodiodes [96]. …”

Section: Hydrophilic and Hydrophobic Bondingmentioning

confidence: 99%

Low-Temperature Bonding for Silicon-Based Micro-Optical Systems

Howlader

Deen

2015

Photonics

View full text Add to dashboard Cite

Abstract:Silicon-based integrated systems are actively pursued for sensing and imaging applications. A major challenge to realize highly sensitive systems is the integration of electronic, optical, mechanical and fluidic, all on a common platform. Further, the interface quality between the tiny optoelectronic structures and the substrate for alignment and coupling of the signals significantly impacts the system's performance. These systems also have to be low-cost, densely integrated and compatible with current and future mainstream technologies for electronic-photonic integration. To address these issues, proper selection of the fabrication, integration and assembly technologies is needed. In this paper, wafer level bonding with advanced features such as surface activation and passive alignment for vertical electrical interconnections are identified as candidate technologies to integrate different electronics, optical and photonic components. Surface activated bonding, superior to other assembly methods, enables low-temperature nanoscaled component integration with high alignment accuracy, low electrical loss and high transparency of the interface. These features are preferred for the hybrid integration of silicon-based micro-opto-electronic systems. In future, new materials and assembly technologies may emerge to enhance the performance of these micro systems and reduce their cost. The article is a detailed review of bonding techniques for electronic, optical and photonic components in silicon-based systems.

show abstract

Direct wafer bonding for encapsulation of fused silica optical gratings

Cited by 19 publications

References 5 publications

A Review of Hydrophilic Silicon Wafer Bonding

A Review of Hydrophilic Silicon Wafer Bonding

Grism manufacturing by low temperature mineral bonding

Low-Temperature Bonding for Silicon-Based Micro-Optical Systems

Contact Info

Product

Resources

About