Direct Eye Diagram Optimization for Arbitrary Transmission Lines Using FIR Filter

Yao, Cheng; Wu, Ruey-Beei

doi:10.1109/tcpmt.2011.2157916

Cited by 18 publications

(5 citation statements)

References 15 publications

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“…A 3-Gb/s ±250-mV differential pseudo-random bit sequence of length 210-1 was applied to each structure and an eye diagram was used to evaluate the signal quality of the three structures. The eye diagram usually represented in terms of the eye height, eye width, peak-to-peak jitter, overshoot, and undershoot [7]. Hence, if one receiver can get a better performance of the eye diagram, the means is that it can get a better performance of the signal quality at the receiver during the time domain.…”

Section: Simulation Resultsmentioning

confidence: 99%

Twisted-Overlap Differential-Pair Approach to Increase Available Layout Space and Reliability in PCB Design

Tuan

Tan

Huang

et al. 2013

AMM

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Modern electronic products require many high-speed differential pairs which require more layout space in PCB design. We propose a twisted-overlap differential-pair (TODP) structure to obtain more routing space and achieve better signal integrity in this study. TODP reduces the layout space requirement by about 25% compared with that required by traditional differential pairs and the twisted differential lines (TDL) structure [2]. Based on an eye diagram performance the TODP design compared to the traditional and TDL designs can improve the peak-to-peak jitter by 26.5% and 12.2%, the overshoot by 14.3% and 2%, the undershoot by 18.8% and 5%, and the eye width by 2 and 1%, respectively. Our results indicate that TODP may be of great benefit in differential-pair PCB design.

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Section: Simulation Resultsmentioning

confidence: 99%

Twisted-Overlap Differential-Pair Approach to Increase Available Layout Space and Reliability in PCB Design

Tuan

Tan

Huang

et al. 2013

AMM

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“…By increasing the value of s, non-linear effects can be assessed. We use an L27(3 5 ) OA in our work in order to capture nonlinear effects in the objective function by only running 27 experiments. We denote this DoE as OA27.…”

Section: B Orthogonal Arrays (Oa)mentioning

confidence: 99%

System Margining Surrogate-Based Optimization in Post-Silicon Validation

Rangel-Patiño

Chavez-Hurtado

Viveros-Wacher

et al. 2017

IEEE Trans. Microwave Theory Techn.

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There is an increasingly higher number of mixedsignal circuits within microprocessors. A significant portion of them corresponds to high-speed input/output (HSIO) links. Postsilicon validation of HSIO links is critical to provide a release qualification decision. One of the major challenges in HSIO electrical validation is the physical layer (PHY) tuning process, where equalization techniques are typically used to cancel any undesired effect. Current industrial practices for PHY tuning in HSIO links are very time consuming since they require massive lab measurements. On the other hand, surrogate modeling techniques allow to develop an approximation of a system response within a design space of interest. In this paper, we analyze several surrogate modeling methods and design of experiments techniques to identify the best approach to efficiently optimize a receiver equalizer. We evaluate the models performance by comparing with actual measured responses on a real server HSIO link. We then perform a surrogate-based optimization on the best model to obtain the optimal PHY tuning settings of a HSIO link. Our methodology is validated by measuring the real functional eye diagram of the physical system using the optimal surrogate model solution.

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“…Using the unit pulse or step response of the link path, we can predict the worst case eye height and deterministic jitter. Such approach can be extended for the matched lossy line [28], multireflected line [29]- [31], and lines with crosstalk [32].…”

Section: Link-path Modeling and Analysismentioning

confidence: 99%

Overview of Signal Integrity and EMC Design Technologies on PCB: Fundamentals and Latest Progress

Buesink

Canavero

2013

IEEE Trans. Electromagn. Compat.

176

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This paper reviews the fundamentals and latest progress of modeling, analysis, and design technologies for signal integrity and electromagnetic compatibility on PCB and package in the past decades. Most results in this field are based on the very rich and highly educational literature produced by Prof. C. Paul in his long scientific career. The inclusion of parameters variability effects is also considered, and it is demonstrated how statistical simulations can become affordable by means of recently-introduced stochastic methods. Finally, the necessity of practical training of designers is mentioned, and an experience relying on realistic PCB demonstrators is illustrated.

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Direct Eye Diagram Optimization for Arbitrary Transmission Lines Using FIR Filter

Cited by 18 publications

References 15 publications

Twisted-Overlap Differential-Pair Approach to Increase Available Layout Space and Reliability in PCB Design

Twisted-Overlap Differential-Pair Approach to Increase Available Layout Space and Reliability in PCB Design

System Margining Surrogate-Based Optimization in Post-Silicon Validation

Overview of Signal Integrity and EMC Design Technologies on PCB: Fundamentals and Latest Progress

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