Diode laser soldering using a lead-free filler material for electronic packaging structures

Chaminade, Cédric; Fogarassy, É.; Boisselier, Didier

doi:10.1016/j.apsusc.2005.07.095

Cited by 21 publications

(3 citation statements)

References 16 publications

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“…The temperature should be strictly controlled during the heating process to ensure a high quality joint. When an IR thermometer is used to measure the joint temperature, the temperature may be controlled by closed-loop feedback controller, including laser power, interaction time, laser spot size, and laser beam displacement [15]. In our case, the energy is brought to the solder paste by direct radiation.…”

Section: The Thermodynamic Model Of Laser Soldering Processmentioning

confidence: 99%

A Novel Thermodynamic Model and Temperature Control Method of Laser Soldering Systems

Chen

Zheng

et al. 2015

Mathematical Problems in Engineering

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Laser technology is vital in production of precision electronic components and has been widely used in modern industry. In laser soldering systems, accurate temperature control remains a challenging problem, since the temperature is highly sensitive to laser power and thermodynamic parameters of solder joints. In this paper, a good solution is proposed to solve the problem by controlling the temperature based on a novel thermodynamic model. In the model, many of the major factors are taken into account, such as laser energy, flux influence, and solder joints with different parameters. Aimed at the thermodynamic process and the influence of solder fluxes, a mixed mode control method is used to track the designed target temperature curve; this method can produce a solder joint with good quality. As a result, a model-based feed-forward and proportional, integral, and derivative (PID) mixed control method is developed. In practice, the proposed method is verified to have a wider product capability and production size; and a rate of good products of 99.94% is achieved with consuming approximately half of the energy comparing with manual soldering and constant laser power soldering.

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Section: The Thermodynamic Model Of Laser Soldering Processmentioning

confidence: 99%

A Novel Thermodynamic Model and Temperature Control Method of Laser Soldering Systems

Chen

Zheng

et al. 2015

Mathematical Problems in Engineering

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“…To avoid serious heat damage to the heat-sensitive electronic devices and the MEMS devices, the soldering time needs to be shortened [9]. We try to use laser to solder rapidly-solidified lead-free solders for two reasons, one is the good characteristics of laser soldering such as rapid melting, rapid cooling and small heat affected zone [10] and the other is that the rapidly-solidified lead-free solders are not suitable for long time. Since soldering rapidlysolidified solders with laser has not been studied in this field, theoretical data for future research, as well as an efficient soldering approach for newly developed lead-free solders are provided by this paper.…”

Section: Introductionmentioning

confidence: 99%

The study of interficial reaction during rapidly solidified lead-free solder Sn3.5Ag0.7Cu/Cu laser soldering

Liu

et al. 2014

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction M

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Interfacial intermetallic compound (IMC) is a necessary condition for the reliability of solder connection. In this study, the fiber lasers were used to solder rapidly-solidified leadfree solder Sn3.5Ag0.7Cu and Cu substrate, investigating the influence of laser soldering process parameters on the growth of IMC at the solid/liquid interface and finding the optimum parameters of laser soldering process. To simulate the IMC growth under actual service conditions, the solder joints under the condition p=50w, v=140mm/min were chosen to age at 150 . Scanning electron microscopy (SEM) and EDS were used to observe IMCs morphology and analyze the composition of IMCs. The results showed that when the laser power was 50w, the thickness of IMCs formed at the interface decreased with the increase of scanning speed. And the morphology of IMCs also changed with the scanning speed. In the aging process, the thickness of the IMCs increased with the aging time, and the morphology became relatively flat. In addition, the thickness of IMCs at the rapidly-solidified Sn3.5Ag0.7Cu/Cu, which was thicker before the aging process, was thinner than that at the ascast Sn3.5Ag0.7Cu/Cu in the subsequent aging process. The distribution of Ag 3 Sn particles formed in the rapidly-solidified lead-free solders was more uniform, which suppressed the growth of Cu 6 Sn 5 in the aging process better.

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“…Some authors [5][6][7] have proposed lead-free laser soldering for overlap and flanged seam geometries, using as low as 10 W laser power. Therefore, for these applications, the laser can be quite a bit cheaper, which could aid in the spread of this methodology.…”

Section: Introductionmentioning

confidence: 99%

Characterization of a laser-soldered avionic component using lead-free paste

Lima¹,

Riva²,

Destro³

et al. 2009

Optics & Laser Technology

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Diode laser soldering using a lead-free filler material for electronic packaging structures

Cited by 21 publications

References 16 publications

A Novel Thermodynamic Model and Temperature Control Method of Laser Soldering Systems

A Novel Thermodynamic Model and Temperature Control Method of Laser Soldering Systems

The study of interficial reaction during rapidly solidified lead-free solder Sn3.5Ag0.7Cu/Cu laser soldering

Characterization of a laser-soldered avionic component using lead-free paste

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