A Novel Thermodynamic Model and Temperature Control Method of Laser Soldering Systems

Abstract

Laser technology is vital in production of precision electronic components and has been widely used in modern industry. In laser soldering systems, accurate temperature control remains a challenging problem, since the temperature is highly sensitive to laser power and thermodynamic parameters of solder joints. In this paper, a good solution is proposed to solve the problem by controlling the temperature based on a novel thermodynamic model. In the model, many of the major factors are taken into account, such as laser energy, flux influence, and solder joints with different parameters. Aimed at the thermodynamic process and the influence of solder fluxes, a mixed mode control method is used to track the designed target temperature curve; this method can produce a solder joint with good quality. As a result, a model-based feed-forward and proportional, integral, and derivative (PID) mixed control method is developed. In practice, the proposed method is verified to have a wider product capability and production size; and a rate of good products of 99.94% is achieved with consuming approximately half of the energy comparing with manual soldering and constant laser power soldering.

Variable-Structure Proportional–Integral–Derivative Laser Solder Joint Temperature Intelligent Control Method with Adjustable Power Upper Limit

“…To address this issue, scholars have established models to predict heating temperatures [ 6 , 7 , 8 ]. Among them, Zhihua Chen et al [ 9 ] proposed a thermodynamic model through which the parameters involved in the controller can be calculated to anticipate temperature changes during laser soldering. Compared with traditional control methods, this scheme has obvious advantages.…”