Abstract:Interfacial intermetallic compound (IMC) is a necessary condition for the reliability of solder connection. In this study, the fiber lasers were used to solder rapidly-solidified leadfree solder Sn3.5Ag0.7Cu and Cu substrate, investigating the influence of laser soldering process parameters on the growth of IMC at the solid/liquid interface and finding the optimum parameters of laser soldering process. To simulate the IMC growth under actual service conditions, the solder joints under the condition p=50w, v=14… Show more
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