2013
DOI: 10.1007/s11663-013-9942-5
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Diffusion Bonding of Ti-6Al-4V Sheet with Ti-6Al-4V Foam for Biomedical Implant Applications

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Cited by 4 publications
(1 citation statement)
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“…Since diffusion bonding is caused by atomic migration across a solid-state interface, there are theoretically no microstructural discontinuities at the interface region and, consequently, the mechanical properties and microstructure in the bonded region are no different from those of the base metal. In addition, when differences exist between the two materials to be joined, the interface zone would be able to mediate their properties [1]. DB can be considered a valid solution in obtaining joints in materials, such as Ti alloys, usually difficult by conventional techniques [2].…”
Section: Introductionmentioning
confidence: 99%
“…Since diffusion bonding is caused by atomic migration across a solid-state interface, there are theoretically no microstructural discontinuities at the interface region and, consequently, the mechanical properties and microstructure in the bonded region are no different from those of the base metal. In addition, when differences exist between the two materials to be joined, the interface zone would be able to mediate their properties [1]. DB can be considered a valid solution in obtaining joints in materials, such as Ti alloys, usually difficult by conventional techniques [2].…”
Section: Introductionmentioning
confidence: 99%