Differential thermal expansion in microelectronic systems

Royce, B. S. H.

doi:10.1109/33.16683

Cited by 19 publications

(2 citation statements)

References 23 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Temporal temperature variations are caused due to time-varying power dissipation rates. Rapid changes in temperature may cause deformation of the package [Royce 1988] and failure due to fatigue.…”

Section: Introductionmentioning

confidence: 99%

Performance-driven dynamic thermal management of MPSoC based on task rescheduling

Ganeshpure

Kundu

2014

ACM Trans. Des. Autom. Electron. Syst.

View full text Add to dashboard Cite

High level of integration has led to the advent of Multiprocessor System-on-Chip (MPSoC) which consists of multiple processor cores and accelerators on the same die. A MPSoC programming model is based on a task graph where tasks are assigned to cores to maximize performance. To address thermal hotspots in MPSoCs, coarse-grain power management techniques based on Dynamic Frequency Scaling (DFS) are widely used. DFS is reactive in nature and has detrimental effects on performance. We propose an alternative solution based on dynamic task rescheduling where a temperature prediction scheme is built into the scheduler. The temperature look-ahead scheme is used for task reassignment or delay insertion in scheduling. Since temperature prediction and task assignment are done at runtime, both must be simple and extremely fast.To that end, we propose a heuristic solution based on a limited branch-and-bound search and compare results against an optimal Integer Linear Programming (ILP)-based solution. The proposed approach is shown to be superior to frequency scaling, and the resulting schedule length is within 5% to 10% of the optimal solution as obtained from ILP formulation.

show abstract

Section: Introductionmentioning

confidence: 99%

Performance-driven dynamic thermal management of MPSoC based on task rescheduling

Ganeshpure

Kundu

2014

ACM Trans. Des. Autom. Electron. Syst.

View full text Add to dashboard Cite

show abstract

“…The oxidation and deposition temperatures used for the fabrication of these devices are different from both the temperatures at which lithographic steps will be canied out and the temperatures at which they will be used. The differential thermal expansion mismatch between the constituent layers of these materials introduces the potential for wafer curvature and thus problems in the wafer processing steps (Royce, 1988).…”

Section: Introductionmentioning

confidence: 99%

A novel bonding technique to bond CTE mismatched devices

Chandran

Schmidt²,

Gordon³

1996 Proceedings 46th Electronic Components and Technology Conference

View full text Add to dashboard Cite

Thermal expanSian mismatch between electronic devices and their substrates induces stresses in the assembly during bonding and operation. These stresses in extreme cases cause cracking of the electronic device during bonding. For GaAs devices back-side bonded to a high conductivity artificial diamond substrate using Au-Sn solder, analytical and numerical analyses were conducted to determine the bonding stresses in the GaAs die. Bonding et s were conducted to study the effect of varying cooling rates on die failure. Experimental data demonstrate that only smaller sized dice (lmm X lmm and 2mm X 2") survived bonding without cracking. This observation was corroborated by analfical and numerical studies which show that the stress induced in the larger dice exceeded the strength of the material. Slow ("2 T/min) but continuous cooling from the bonding temperature did not improve the survival rate of the dice si@icantly. A new cooling scheme was developed utilizing the high temperature creep properties of the Au-Sn solder. This cooling scheme incorpora solder layer creep at high temperatures to relieve the stresses in the attached die. Bonding experiments with sizes up to 1 0 " X l o " and thicknesses down to 4 mils were performed with a 100% survival rate of the dice. Introduction:To meet the demand for higher performance microelectronics,

show abstract

Static and Dynamic Analyses of Surface Mount Component Leads and Solder Joints

Lau¹

1991

Solder Joint Reliability

View full text Add to dashboard Cite

Differential thermal expansion in microelectronic systems

Cited by 19 publications

References 23 publications

Performance-driven dynamic thermal management of MPSoC based on task rescheduling

Performance-driven dynamic thermal management of MPSoC based on task rescheduling

A novel bonding technique to bond CTE mismatched devices

Static and Dynamic Analyses of Surface Mount Component Leads and Solder Joints

Contact Info

Product

Resources

About