A novel bonding technique to bond CTE mismatched devices

Chandran, B.; Schmidt, W.; Gordon, Mollie

doi:10.1109/ectc.1996.550882

Cited by 11 publications

(3 citation statements)

References 14 publications

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“…A comparison of room-temperature creep properties of three Sn-Sb alloys, Sn-3.5In-2.4Sb, and several other potential creep-resistant lead-free solder alloys. The curve in the bottom right corner 19 represents "creep properties" derived from stress relaxation data for Sn-80Au. Volume fractions of the intermetallic particles that form when these particles react with tin are expected to be a good deal greater than 15%.…”

Section: Discussionmentioning

confidence: 99%

High creep resistance tin-based alloys for soldering applications

McCabe

Fine

2002

Journal of Elec Materi

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Section: Discussionmentioning

confidence: 99%

High creep resistance tin-based alloys for soldering applications

McCabe

Fine

2002

Journal of Elec Materi

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“…Devices able to switch at higher frequencies allow for a reduction in size of power devices like magnetics and capacitors. Compared with the machine, the converter has a much higher power density with typical heat flux densities in the range of 50-500 W/cm 2 for power semiconductor devices, compared with 0.1-3 W/cm 2 for magnetic components and less than 0.1 W/cm 2 for capacitors [200]. This is due to its smaller volume and high power handling capabilities [201].…”

Section: Challenges In Imd Designmentioning

confidence: 98%

Integrated motor drives: state of the art and future trends

2017

IET Electric Power Applications

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With increased need for high power density, high efficiency and high temperature capabilities in aerospace and automotive applications, integrated motor drives (IMD) offers a potential solution. However, close physical integration of the converter and the machine may also lead to an increase in components temperature. This requires careful mechanical, structural and thermal analysis; and design of the IMD system. This study reviews existing IMD technologies and their thermal effects on the IMD system. The effects of the power electronics position on the IMD system and its respective thermal management concepts are also investigated. The challenges faced in designing and manufacturing of an IMD along with the mechanical and structural impacts of close physical integration is also discussed and potential solutions are provided. Potential converter topologies for an IMD like the matrix converter, two-level bridge, three-level neutral point clamped and multiphase full bridge converters are also reviewed. Wide band gap devices like silicon carbide and gallium nitride and their packaging in power modules for IMDs are also discussed. Power modules components and packaging technologies are also presented. IntroductionOver the last two decades there has been a shift from traditional physically separated motor and drive systems to more compact, power dense, motor-drive combinations [1]. This new power-dense motor-drive structure combines both the motor and its associated control and drive circuitry within a single enclosure. The earliest records of commercially available motor-drive systems were manufactured by Grundfos in 1991 and Franz Morat KG in 1993 [2].These compact systems have been called a variety of names from 'smart motors' to 'integrated motors', the latter forming the foundation for the new moniker currently identified with these systems [3]. The term 'integrated motor drive (IMD)' is the latest associated with this class of products and is as a result of the success of a TB Woods Inc. manufactured motor-drive registered under the same name [3].IMDs are increasingly being developed and produced by machine manufacturers due to the significant potential benefits they offer. The most significant of these benefits include direct replacement of inefficient direct on line motors, increased power density, lower losses and lower costs compared with separate motor and drive solutions. Technological advancements over the last decade have led to the development of robust electronic components able to withstand the harsh environments required by some forms of integration [4]. By eliminating separate enclosures and long cable runs, the integrated approach promises to lower system costs by 20 to 40% [5].Elimination of transmission cables has economic advantages, including increased reliability due to the removal of the output filter commonly required for long cables. Removal of long cable runs and integration into a single package will also significantly reduce potential electromagnetic interference (EMI). This a...

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“…The slow cooling process also shows better metallurgical effects such as diffusion and alloying [93]. However, this cooling scheme requires long bonding duration [94].…”

Section: Bonding Process Considerationsmentioning

confidence: 99%

Study and development of advanced packaging technique for semiconductor lasers

Teo¹

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The development of Erbium-Doped Fiber Amplifiers (EDFA) in long-haul telecommunications applications resulted in the rapid evolution of high power semiconductor lasers. In these applications, the demand for increased channel density in fiber-optic communication has pushed forward the use of single-mode ridge-waveguide laser diodes (LDs). One of the major concerns in these single-mode LD packages is the thermal management of the module. These semiconductor lasers usually generate large heat fluxes, up to the range of MWcm" 2 , that adversely affect their performance and reliability. Thus, the aim of packaging is to dissipate heat as efficiently as possible, in order to operate the LD at its maximum optical performance, without exceeding the permitted device temperature. As a first stage packaging, die-attachment of LDs onto a submount/heatsink is adopted and face-down bonding approach is recommended to meet the large heat generation rate. Some of the packaging-related issues faced in this bonding configuration are precision bonding alignment, low bonding yield, high bonding stress, good bonding integrity, as well as long-term reliability issues. This thesis introduces the development of a modified bonding technique for single-mode ridge-waveguide LDs. The effects of bonding parameters on the microstructure, bonding integrity of the solder joint, and LD performances were analyzed. Reliability tests such as thermal cycling and accelerated aging tests were also performed to prove the package's long-term stability. The solder joint possessed good long-term reliability, with little intermetallic compounds (IMC) growth at the interfaces. The formation of Au-rich P and i ATTENTION: The Singapore Copyright Act applies to the use of this document. Nanyang Technological University Library CJ phase Au/Sn compounds in the solder joint limit the interfacial IMC growth. Mechanical testing exhibited excellent bonding integrity, with brittle fracture occurring within the LD. No degradation of threshold current I t h could be observed and a 3X optical improvement over unbonded LDs was attained due to improved thermal management. Band structure theory of semiconductor lasers was conducted to understand the temperature-dependence characteristics of LDs. Transient and steady-state thermal analysis of semiconductor lasers showed that the heat generated in the LD and its associated thermal resistance R t h was induced by the radiative energy transfer of free carriers. The dependence of R t h on different bonding configurations and its correlation with the output power was discussed. Finite Element (FE) modeling was also carried out to provide theoretical understanding on the temperature distribution and thermal dissipation for different bonding configurations. Face-down bonded LDs demonstrated improved thermal management with-80% of heat flow towards the heatsink while faceup bonded LDs could only manage-50%. The analytical method using electronic band structure calculations and FE modeling gave close fitting to the experimental result...

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A novel bonding technique to bond CTE mismatched devices

Cited by 11 publications

References 14 publications

High creep resistance tin-based alloys for soldering applications

High creep resistance tin-based alloys for soldering applications

Integrated motor drives: state of the art and future trends

Study and development of advanced packaging technique for semiconductor lasers

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