Dielectric and Thermal Conductivity Characteristics of Epoxy Resin-Impregnated H-BN/CNF-Modified Insulating Paper

Yang, Hongda; Chen, Qingguo; Wang, Xinyu; Chi, Minghe; Zhang, Jinfeng

doi:10.3390/polym12092080

Cited by 10 publications

(6 citation statements)

References 15 publications

(19 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Refs. [20,33,34] reported a similar result to our study, which is that the addition of BN (10 wt %) results in the enhancement in both thermal conductivity and breakdown strength.…”

Section: Discussionsupporting

confidence: 89%

“…Thus, enhancement in the thermal transport performance of nozzle materials may improve arc ablation resistance performance. The thermal transport performance of polymers can be enhanced by the following two ways: optimizing the structures of the polymers themselves or by filling their matrices with high-thermal-conductivity fillers (the filled polymers) [18][19][20][21][22][23][24][25]. Compared with the former methods, the latter methods have attracted much attention because the polymeric composites are easily achieved.…”

Section: Introductionmentioning

confidence: 99%

“…Compared with the former methods, the latter methods have attracted much attention because the polymeric composites are easily achieved. For the polymeric composites, many fillers with high thermal conductivity, such as metal powder [18], metal oxide [19], metal or non-metal nitrides [20][21][22][23], and graphene [24,25], can be used to enhance thermal transport performance. Therefore, it is essential to select appropriate fillers according to the actual demand.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Arc Ablation Resistance and Dielectric Strength Properties of PTFE/BN Composites

Zhao¹,

Nie²,

Zhao³

et al. 2021

Energies

View full text Add to dashboard Cite

The substantial improvements in transmission voltage, which have been adopted to meet fast-growing energy demands, require more reliable power equipment and higher-quality insulating materials. The polytetrafluoroethylene (PTFE) nozzle, as the key part of a high-voltage circuit breaker, is often subjected to arc ablation and breakdown phenomena. Thus, it is very urgent to develop nozzles with better performance. In this study, PTFE/boron nitride (BN) composites were prepared. The relationships among the BN filler loading, thermal transition properties, spectral reflectance properties, arc ablation resistance, and AC dielectric breakdown performances, as well as their corresponding mechanisms, were studied. Experimental results show that the thermal conductivity and thermal diffusivity of PTFE/BN composites increased monotonously with BN loading, and that both parameters were improved by 41% and 44%, respectively, for 11 wt % composites compared with pure PTFE. Moreover, PTFE/BN composites had higher light reflectance in the wavelength range from 320 to 2500 nm. The PTFE/BN composites presented better arc ablation resistance performance with increased BN loading, which was improved by 88.5%. It is thought that the increased thermal conductivity, thermal diffusivity, the strong light reflectance, and surface sediment after arc ablation contribute to the improvement in arc ablation resistance performance. The AC breakdown strength of PTFE/BN composites was enhanced by 30.93%, attributed to the good heat dissipation properties introduced by the BN fillers. Thus, filling BN into the PTFE matrix would be helpful to solve the equipment issue that comes from the improvement in transmission voltage.

show abstract

“…Refs. [20,33,34] reported a similar result to our study, which is that the addition of BN (10 wt %) results in the enhancement in both thermal conductivity and breakdown strength.…”

Section: Discussionsupporting

confidence: 89%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Arc Ablation Resistance and Dielectric Strength Properties of PTFE/BN Composites

Zhao¹,

Nie²,

Zhao³

et al. 2021

Energies

View full text Add to dashboard Cite

show abstract

“…Yang et al added hexagonal boron nitride (h-BN) nanoflakes into the insulation paper before impregnating with EP, demonstrating the excellent suppression effect of space charge injection. [219] In a follow-up study, [220] the authors adopted nanocellulose fiber (CNF) as a "bridge" between h-BN and paper cellulose to improve the compatibility. As a result, the ternary EIP/h-BN/CNF composite with 0.1 wt% CNFs exhibited more remarkable space charge suppression capability than the binary EIP/h-BN composite with the same h-BN filler concentration.…”

Section: Effect Of Nanoparticles On Space Charge Behaviormentioning

confidence: 99%

Space Charge Behavior in Epoxy‐Based Dielectrics: Progress and Perspective

Liu

Xie

et al. 2022

Adv Elect Materials

View full text Add to dashboard Cite

temperature and complex electric field conditions. [1][2][3] Epoxy resin (EP) is a class of polymer oligomers containing two or more epoxide groups based on organic compounds (e.g., aliphatic, alicyclic, and aromatic). As a prepolymer, EP shows excellent performance after its reaction with a curing agent to form an insoluble polymer with a 3D network structure. EP has desirable insulating characteristics, [4][5][6][7] heat resistance, [8] high mechanical strength, [9] low shrinkage, [10] chemical stability, and adhesive properties, which originate from its compact structure and tunable functional groups. The above mentioned outstanding performances, along with characteristics of easy processing and formula design flexibility, enable the extensive use of EP-based materials in power equipment and electronic devices [11] (Figure 1), including bar insulation and impregnating varnish in transformers, main insulation in dry-type bushings and wall bushings, insulator in gas-insulated switchgear (GIS) and gas-insulated transmission line (GIL), epoxy molding compound for integrated circuit (IC) packaging. It is noteworthy that EPs typically possess lower glass transition temperature (T g ) compared to other high-T g dielectric polymer substitutes used in microelectronic systems such as benzocyclobutene, [12] polyimide (PI), [13] and maleimide. [14] Besides high T g , high thermal conductivity and low coefficient of thermal expansion of EPs are always desired for their industrial applications, especially from an electronic packaging perspective. To date, considerable efforts have been made to improve the heat endurance and heat dissipation capabilities of EP-based dielectric materials by inorganic particle doping [15][16][17][18][19][20][21][22][23][24] and chemical modification. [25][26][27] Furthermore, EP is also an indispensable adhesive that is extensively used in power equipment. [28][29][30][31][32] Yet, potential reliability hazards may exist during the operation of power equipment and electronic devices, especially at high temperatures and under high voltage direct current (HVDC) application, one of which is the space charge accumulation in EP-based dielectric materials. [29,30,33,34] The accumulated space charge may cause deterioration/aging and even partial discharge or dielectric breakdown of dielectric materials. [35][36][37][38][39][40] Specifically, the extensive application of EP-based dielectric materials in HVDC transmission projects eagerly calls for relevant studies on the space charge behavior Epoxy-based dielectrics are extensively used in grid-connected energy systems and modern microelectronics as electrical insulation, adhesive, and packaging components. However, space charge accumulation in epoxy-based dielectrics is a foremost factor threatening device stability and lifespan, especially under conditions of high voltage direct current and high temperatures during long-term operation, and thus are investigated systematically. This article reviews the state-of-the-art progress in understanding and r...

show abstract

“…Therefore, developing new composite insulation materials which offer excellent thermal conductivity but low electrical conductivity has attracted significant interest worldwide [ 14 , 15 ]. In recent years, researchers have undertaken much research on the space charge and dielectric behavior of epoxy composites [ 16 , 17 , 18 , 19 , 20 , 21 ], but the charge transport and space charge accumulation behavior under high temperature and high electric field still need to be further explored.…”

Section: Introductionmentioning

confidence: 99%

Effect of Temperature on the Charge Transport Behavior of Epoxy/Nano−SiO2/Micro−BN Composite

2022

View full text Add to dashboard Cite

Thermally conductive epoxy resin composites are widely used as electrical equipment insulation and package materials to enhance heat dissipation. It is important to explore the dielectric properties of the composites at high temperatures for the safe operation of the equipment. This paper investigated the charge transport behavior of an epoxy/nano−SiO2/micro−BN composite at varied temperatures by combined analysis of the TSDC (thermally stimulated current), conduction current, complex permittivity and space charge distribution between 40 and 200 °C. The results show that ionic space charge accumulation was significantly suppressed in the composite at high temperatures. The conduction current increased gradually with temperature and manifested a remarkable shift from electron charge transport to ion charge transport near the glass transition temperature (Tg). The real and imaginary permittivity showed an enormous increase above Tg for both the epoxy resin and the composite. The conduction current and permittivity of the composite were remarkably reduced in comparison to the epoxy resin. Therefore, the ionic process dominated the high temperature dielectric properties of the epoxy resin and the composite. The nano–micro fillers in the composite can significantly inhibit ion transport and accumulation, which can significantly enhance the dielectric properties of epoxy resin. Thus, the nano–micro composite has a strong potential application as a package material and insulation material for electronic devices and electrical equipment operated at high temperatures.

show abstract

Dielectric and Thermal Conductivity Characteristics of Epoxy Resin-Impregnated H-BN/CNF-Modified Insulating Paper

Cited by 10 publications

References 15 publications

Arc Ablation Resistance and Dielectric Strength Properties of PTFE/BN Composites

Arc Ablation Resistance and Dielectric Strength Properties of PTFE/BN Composites

Space Charge Behavior in Epoxy‐Based Dielectrics: Progress and Perspective

Effect of Temperature on the Charge Transport Behavior of Epoxy/Nano−SiO2/Micro−BN Composite

Contact Info

Product

Resources

About