temperature and complex electric field conditions. [1][2][3] Epoxy resin (EP) is a class of polymer oligomers containing two or more epoxide groups based on organic compounds (e.g., aliphatic, alicyclic, and aromatic). As a prepolymer, EP shows excellent performance after its reaction with a curing agent to form an insoluble polymer with a 3D network structure. EP has desirable insulating characteristics, [4][5][6][7] heat resistance, [8] high mechanical strength, [9] low shrinkage, [10] chemical stability, and adhesive properties, which originate from its compact structure and tunable functional groups. The above mentioned outstanding performances, along with characteristics of easy processing and formula design flexibility, enable the extensive use of EP-based materials in power equipment and electronic devices [11] (Figure 1), including bar insulation and impregnating varnish in transformers, main insulation in dry-type bushings and wall bushings, insulator in gas-insulated switchgear (GIS) and gas-insulated transmission line (GIL), epoxy molding compound for integrated circuit (IC) packaging. It is noteworthy that EPs typically possess lower glass transition temperature (T g ) compared to other high-T g dielectric polymer substitutes used in microelectronic systems such as benzocyclobutene, [12] polyimide (PI), [13] and maleimide. [14] Besides high T g , high thermal conductivity and low coefficient of thermal expansion of EPs are always desired for their industrial applications, especially from an electronic packaging perspective. To date, considerable efforts have been made to improve the heat endurance and heat dissipation capabilities of EP-based dielectric materials by inorganic particle doping [15][16][17][18][19][20][21][22][23][24] and chemical modification. [25][26][27] Furthermore, EP is also an indispensable adhesive that is extensively used in power equipment. [28][29][30][31][32] Yet, potential reliability hazards may exist during the operation of power equipment and electronic devices, especially at high temperatures and under high voltage direct current (HVDC) application, one of which is the space charge accumulation in EP-based dielectric materials. [29,30,33,34] The accumulated space charge may cause deterioration/aging and even partial discharge or dielectric breakdown of dielectric materials. [35][36][37][38][39][40] Specifically, the extensive application of EP-based dielectric materials in HVDC transmission projects eagerly calls for relevant studies on the space charge behavior Epoxy-based dielectrics are extensively used in grid-connected energy systems and modern microelectronics as electrical insulation, adhesive, and packaging components. However, space charge accumulation in epoxy-based dielectrics is a foremost factor threatening device stability and lifespan, especially under conditions of high voltage direct current and high temperatures during long-term operation, and thus are investigated systematically. This article reviews the state-of-the-art progress in understanding and r...

No abstract