Abstract:In this work, the variation of die stress during thermal cycling and thermal aging reliability tests has been explored experimentally. Special (1 11) silicon stress test chips containing an array of piezoresistive sensor rosettes have been applied within 281-pin ceramic Pin Grid Array (PGA) packages. The test die contained optimized eight element dual polarity rosettes, which are uniquely capable of evaluating the complete stress state at points on the surface of the die. Calibrated and characterized test chip… Show more
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