Die Bonding for a Nitride Light-Emitting Diode by Low-Temperature Sintering of Micrometer Size Silver Particles

Kuramoto, Masafumi; Ogawa, S.; Niwa, Miki; Kim, Keun Soo; Suganuma, Katsuaki

doi:10.1109/tcapt.2010.2064313

Cited by 46 publications

(17 citation statements)

References 6 publications

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“…The optical properties of PKG components are particularly important parameters as regards LED product performance, because an electric input loss of more than 10% is caused by the PKG. 4 In the case of white LEDs, the PKG is composed of various component materials, primarily PKG resin (injection molding resin), mold resin (silicone or epoxy) 9-11 containing a phosphor [12][13][14][15][16] and a diffuser material, a lead frame (L/F), 17,18 die-bonding paste, 19,20 and bonding wire. [21][22][23] Each component has been investigated intensively with regard to its performance in each area of the device.…”

Section: Introductionmentioning

confidence: 99%

Optimization of surface-mount-device light-emitting diode packaging: investigation of effects of component optical properties on light extraction efficiency

et al. 2016

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An investigation of the effects of the optical properties of surface-mount-device (SMD) light-emitting diode (LED) (side-view and top-view LEDs) packaging (PKG) components on the light extraction efficiency η PKG using ray-tracing simulations is presented. In particular, it is found that the optical properties of the PKG resin and the lead-frame (L/F) silver-plating significantly affect η PKG. Thus, the effects of the surface reflection methods of these components are investigated in order to optimize the optical design of the LED PKG. It is shown that there exists peak extraction efficiency for each PKG, and the cavity angle formed by the cavity wall is important to the optical design. In addition, the effect of phosphor present in the mold resin is examined using a Mie scattering simulation. Finally, an SMD LED PKG optical design method is proposed on the basis of the simulation results.

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Section: Introductionmentioning

confidence: 99%

Optimization of surface-mount-device light-emitting diode packaging: investigation of effects of component optical properties on light extraction efficiency

et al. 2016

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“…Ag powder sintering is a pressureless die attachment process using micro-or, in some cases, nanometer scale Ag particles. The nanoscale particle size enables the sintering to be possible at around 200 °C due to its high surface energy/volume [2,3]. Some of the benefits of this method include the completion of the process at low temperature without damaging Si die or interconnects and formation of interface that has better thermal conductivity than conventional Ag epoxy die attach materials.…”

Section: The New User Condition For Future Electronics: Wider Temperamentioning

confidence: 99%

Challenges in Future-Generation Interconnects: Microstructure Again

Lee

Bieler

Kim

et al. 2014

Fundamentals of Lead-Free Solder Interconnect Technology

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The aim of this chapter is not to introduce the packaging technology of the future nor the challenges in specific packaging structure. Rather, it is to review the characteristics of technology on the horizon along with the introduction of materials under consideration, briefly consider possible problems associated with such technology, and stress the need for understanding more on the solder itself. For this, this chapter firstly discusses the need for considering new boundary condition of the interconnects that arise from the use of electronics in harsher environment in a small form factor. It is followed by the discussion on the packaging challenges in higher power devices such as the power handling devices and LEDs. Then, material challenges associated with device miniaturization as well as the increased current density in solder interconnects are presented. Finally, the need for and difficulty in developing multiscale model for solder joint property and its behaviors in packaging structure is briefly discussed in order to reemphasize the urgency of achieving more advanced understanding of the Pb-free solder materials in general. Future Packaging and Next-Generation Interconnects: KeywordsThe keywords for future packaging and next-generation interconnects are smaller form factor, higher performance, flexible in form factor and applications, and lower power consumption than the devices used in today's technology. Demand for such devices emerges as electronic devices are increasingly used in unconventional places, and this trend will only increase in the foreseeable future. Such devices will be designed with miniaturization, wider applications, extreme environments, wearable electronics, low power, flexible, more functionality, vertical stacking and 3D architectures, active thermal management, and high current density as design goals and constraints. Critical issues in relation to the development of such devices include the power device package design, MEMS, 3D wafer-level packages, complex

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“…The performance of the white LED PKG is principally determined by the structure [8,9] and optical properties of the PKG components, namely, PKG resin (injection moulding resin), a lead frame (L/F) [10,11], die-bonding paste [12,13], bonding wire [14][15][16], mould resin (silicone or epoxy resin) [17][18][19] containing a phosphor [20][21][22][23][24][25], and diffuser materials [26]. Performance of each PKG component has been improved in development of each area.…”

Section: Introductionmentioning

confidence: 99%

Investigation of effects of phosphor particles on optimal design of surface‐mount‐device light‐emitting diode packaging using ray‐tracing simulation

Kashiwao

Hiura

Ikeda

et al. 2018

IET Optoelectronics

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Die Bonding for a Nitride Light-Emitting Diode by Low-Temperature Sintering of Micrometer Size Silver Particles

Cited by 46 publications

References 6 publications

Optimization of surface-mount-device light-emitting diode packaging: investigation of effects of component optical properties on light extraction efficiency

Optimization of surface-mount-device light-emitting diode packaging: investigation of effects of component optical properties on light extraction efficiency

Challenges in Future-Generation Interconnects: Microstructure Again

Investigation of effects of phosphor particles on optimal design of surface‐mount‐device light‐emitting diode packaging using ray‐tracing simulation

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