2020
DOI: 10.1007/s00339-019-3246-9
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Device physics and design of hetero-gate dielectric tunnel field-effect transistors with different low/high-k EOT ratios

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Cited by 6 publications
(4 citation statements)
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“…In this investigation, −Xsh was set equal to the source length to definitely exclude the effect of a source-side dielectric heterojunction. A low/high-k EOT ratio of 10 was employed (i.e., the dielectric constant of high-k layers is 39) to maximize the on-current enhancement by the HGD engineering (Shih et al, 2020). Firstly, the ambipolar current is still observed in double-gate TFETs, although both the techniques of HGD and low drain doping are used simultaneously.…”
Section: Device Structures and Simulation Modelsmentioning
confidence: 99%
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“…In this investigation, −Xsh was set equal to the source length to definitely exclude the effect of a source-side dielectric heterojunction. A low/high-k EOT ratio of 10 was employed (i.e., the dielectric constant of high-k layers is 39) to maximize the on-current enhancement by the HGD engineering (Shih et al, 2020). Firstly, the ambipolar current is still observed in double-gate TFETs, although both the techniques of HGD and low drain doping are used simultaneously.…”
Section: Device Structures and Simulation Modelsmentioning
confidence: 99%
“…In the off-state region, the drain-side dielectric heterojunction helps to suppress the ambipolar current of TFETs, whereas the source-side dielectric heterojunction has no impact on their off-state performance. In the on-state region, while the drain-side dielectric heterojunction indirectly affects the on-current by determining the subthreshold swing, the source-side dielectric heterojunction directly influences the on-current by modulating the on-state tunnel width (Shih et al, 2020). Therefore, the effect of device structure on the role of the source-side dielectric heterojunction is probably different from that on the role of the drain-side dielectric heterojunction.…”
Section: Role Of Source-side Dielectric Heterojunctionmentioning
confidence: 99%
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“…However, the conduction current is considerably lower in TFETs than in MOSFETs because performing the band-to-band tunneling (BTBT) process of carriers is much more difficult than performing their thermal injection [5,6]. Many techniques were proposed to enhance TFET oncurrent, including material and structural methods [7][8][9][10][11]. The proposed solutions were based on exploiting the mechanisms of device physics which are more sophisticated in TFETs than in MOSFETs.…”
Section: Introductionmentioning
confidence: 99%