1994
DOI: 10.1109/16.333843
|View full text |Cite
|
Sign up to set email alerts
|

Device parameter changes caused by manufacturing fluctuations of deep submicron MOSFET's

Abstract: She has worked as a systems analyst and consultant for systems engineering and operations research in both industry and universities. She joined Griffith University in 1986, where she is presently working toward the Ph.D. in manufacturing fluctuation phenomena and quality control of integrated circuits. Her research interests are in systems engineering, industrial automation, quality control in manufacturing, operations research, and intelligent systems.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
5

Citation Types

0
11
0

Year Published

1999
1999
2008
2008

Publication Types

Select...
5
3
1

Relationship

0
9

Authors

Journals

citations
Cited by 31 publications
(11 citation statements)
references
References 7 publications
0
11
0
Order By: Relevance
“…Different parameters may affect different elements in a clock distribution network. For instance, non-uniformities in the thickness of the gate oxide and imperfections in the polysilicon etching process [5] can cause variations in the current flow within a transistor, thereby affecting the signal delay. Environmentally induced parameter variations caused by changes in the ambient temperature [6] and external radiation [7] also introduce delay variations.…”
Section: Introductionmentioning
confidence: 99%
“…Different parameters may affect different elements in a clock distribution network. For instance, non-uniformities in the thickness of the gate oxide and imperfections in the polysilicon etching process [5] can cause variations in the current flow within a transistor, thereby affecting the signal delay. Environmentally induced parameter variations caused by changes in the ambient temperature [6] and external radiation [7] also introduce delay variations.…”
Section: Introductionmentioning
confidence: 99%
“…Variations in transistor switching speed [6] can affect the timing characteristics of a register, thereby causing timing constraint violations. Therefore, a system malfunction may occur, not only due to uncertainty in the signal propagation delay, but also due to variations of the timing characteristics within a register.…”
Section: Introductionmentioning
confidence: 99%
“…To work towards the continuing improvement of performance and density of ULSI technology MOSFET devices are scaled down to sub-0.1 lam dimensions. It results in a decreasing number of channel impurities whose random distribution leads to significant fluctuations of threshold voltage and off-state leakage current [1] which are likely to induce serious consequences on the operation and performance of logical and analog circuits [2]. For such dimensions of active region, impurities cannot be anymore considered as a doping continuum.…”
Section: Introductionmentioning
confidence: 99%