2011
DOI: 10.1016/j.orgel.2011.04.016
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Development of the field-effect mobility in thin films of F16PcCu characterized by electrical in situ measurements during device preparation

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Cited by 24 publications
(22 citation statements)
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“…The surface showed height fluctuations of only up to 10 nm, less than the average film thickness of 20 nm. The grains are uniform in size and shape and form a continuous film without pinholes or obvious discontinuities, providing a semiconductor suitable for OFET with good conduction pathways as also obtained in earlier studies which showed a similar morphology of F 16 PcCu thin films [26]. The output characteristics of a device prepared in top-contact/ bottom gate OFET geometry directly after deposition of F 16 PcCu are shown in Fig.…”
Section: Top-contact/bottom Gate Fetsupporting
confidence: 66%
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“…The surface showed height fluctuations of only up to 10 nm, less than the average film thickness of 20 nm. The grains are uniform in size and shape and form a continuous film without pinholes or obvious discontinuities, providing a semiconductor suitable for OFET with good conduction pathways as also obtained in earlier studies which showed a similar morphology of F 16 PcCu thin films [26]. The output characteristics of a device prepared in top-contact/ bottom gate OFET geometry directly after deposition of F 16 PcCu are shown in Fig.…”
Section: Top-contact/bottom Gate Fetsupporting
confidence: 66%
“…Electrical characteristics (a, c) and photograph (b) of finished bottom-contact/top-gate FETs. by the same method, but on the oxidized surface of a silicon wafer [26], which gave values for the electron mobility around 1 Á 10 À 3 cm 2 V À 1 s À 1 . The thickness of the gate insulator in these studies was 300 nm, so in direct comparison, the field-effect is higher and as expected, leads to on/off ratios around 10 4 .…”
Section: Bottom-contact/top-gate Fetmentioning
confidence: 99%
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“…Arrays of parallel interdigitated 50 nm thick bands of Ag or Au with a width W e of 5.16, 10.27, 20.47, or 40.50 lm separated by a gap of width W g of 4.84, 9.73, 19.53, or 39.50 lm as determined by scanning electron microscopy (SEM) and profilometry were prepared by photolithography (5, 10, 20, or 40 lm structure size) on thermally oxidized (300 nm) Si wafers (Wacker) as described previously [23]. Bands of Ag (Au) were used for the experiments reported in Fig Electrochemical deposition was performed by an IviumStat potentiostat on 12 mm 9 10 mm pieces of the processed wafers with a set of two interdigitated metal band electrodes mounted on a rotating disk (radiometer analytical) as working electrode.…”
Section: Methodsmentioning
confidence: 99%
“…Microstructured electrode arrays (20 µm and 40µm structure size) of gold were prepared as described earlier [8]. Thin films of PPTPP, PPTTPP, and TTPPTT were vapor-deposited and analyzed during growth in their output characteristics dependent on the gate voltage as also described earlier [8] at an applied field of 10 V and at a substrate temperature of 100 °C in a first series of experiments.…”
Section: Methodsmentioning
confidence: 99%