2020 47th IEEE Photovoltaic Specialists Conference (PVSC) 2020
DOI: 10.1109/pvsc45281.2020.9300462
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Development of germanium-on-germanium engineered substrates for III-V multijunction solar cells

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Cited by 6 publications
(6 citation statements)
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“…Typical surfaces are almost one order of magnitude rougher than an unprocessed epi‐ready Ge wafer (~2 nm RMS for GeON vs. 0.2 nm RMS for epi‐ready wafer). However, this type of roughness was previously found to be compatible with III–V epitaxy 11,20 . Furthermore, the amplitude and granularity of this waviness are significantly smoothened out by the layer thickening in the present conditions, reaching ~0.7 nm RMS (Figure 12a–c).…”
Section: From 1‐μm Up To 30‐μm‐thick Geon Foil With High Growth‐rate ...supporting
confidence: 67%
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“…Typical surfaces are almost one order of magnitude rougher than an unprocessed epi‐ready Ge wafer (~2 nm RMS for GeON vs. 0.2 nm RMS for epi‐ready wafer). However, this type of roughness was previously found to be compatible with III–V epitaxy 11,20 . Furthermore, the amplitude and granularity of this waviness are significantly smoothened out by the layer thickening in the present conditions, reaching ~0.7 nm RMS (Figure 12a–c).…”
Section: From 1‐μm Up To 30‐μm‐thick Geon Foil With High Growth‐rate ...supporting
confidence: 67%
“…However, this type of roughness was previously found to be compatible with III-V epitaxy. 11,20 Furthermore, the amplitude and granularity of this waviness are significantly smoothened out by the layer thickening in the present conditions, reaching $0.7 nm RMS (Figure 12a-c). At the F I G U R E 9 SIMS depth profiles of a boron-doped 10.5-μm-thick epitaxial layer grown on a gallium-doped GeON wafer.…”
Section: Epitaxial Ge Foil Qualitymentioning
confidence: 61%
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“…The GeON scheme can be extended to (defect free) bulk Ge for which the fabrication of GeON followed by layer transfer has recently been demonstrated. 18,27 The latter approach is limited to 200 mm wafer dimensions (which is the maximum size of available Ge substrates) while the work discussed in this manuscript can be extended to 300 mm wafer dimensions. Finally, it is noted that, although it was not done in this work, an additional Ge epitaxy on top of the GeON template can be considered to adapt the thickness of the Ge foil.…”
Section: Discussionmentioning
confidence: 99%