“…Alternatively, a lower work function, and heavily doped p-type semiconductor is placed between the CdTe and metallic contact, serving as an interlayer. Such measures, referred to as back surface field (BSF) increases cell performance by reducing the recombination at the back contact, leading to improved V oc and reduced series resistance [44,46]. Some commonly used metals and semiconductors, either alone or in combination with others (especially Cu), as back contact layers on glass include C : Cu, Cu, Au, Ag, Sb, Ni, Mo, Te, ZnTe, Sb 2 Te 3 , As 2 Te 3 , CuTe, and HgTe, [6,12,24,26,29,32,44,[47][48][49] When some of these were used in flexible cells, improved cell performances were observed.…”