Development of an extreme temperature range silicon carbide power module for aerospace applications

Katsis, Dimos; Zheng, Yunqi

doi:10.1109/pesc.2008.4591943

Cited by 40 publications

(13 citation statements)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…To minimize mechanical fatigue during high thermal cycling, sintered silver can be used as the die attach method in order to take advantage of its ability to absorb the repeated mechanical stresses associated with mismatches in the Coefficient of Thermal Expansion (CTE) between the die and substrate materials [60]. Some other materials (e.g., MoCu and AlSiC) offer a relatively close CTE match with SiC which helps to achieve more reliable die attachment.…”

Section: ) Power Electronics Reliability/robustness Technologiesmentioning

confidence: 99%

The Past, Present, and Future of Power Electronics Integration Technology in Motor Drives

Jahns¹,

Dai²

2017

CPSS TPEA

139

View full text Add to dashboard Cite

Section: ) Power Electronics Reliability/robustness Technologiesmentioning

confidence: 99%

The Past, Present, and Future of Power Electronics Integration Technology in Motor Drives

Jahns¹,

Dai²

2017

CPSS TPEA

139

View full text Add to dashboard Cite

“…This issue was addressed in a 2008 paper from General Electric, in which design choices were explored to ensure operation at 250 • C [24]. Substrates, die, attach materials, interconnects, and encapsulation materials were explored individually.…”

Section: Trends In Wire Bonded Silicon Carbide Packagingmentioning

confidence: 99%

High Performance Silicon Carbide Power Packaging—Past Trends, Present Practices, and Future Directions

Seal

Mantooth

2017

Energies

View full text Add to dashboard Cite

This paper presents a vision for the future of 3D packaging and integration of silicon carbide (SiC) power modules. Several major achievements and novel architectures in SiC modules from the past and present have been highlighted. Having considered these advancements, the major technology barriers preventing SiC power devices from performing to their fullest ability were identified. 3D wire bondless approaches adopted for enhancing the performance of silicon power modules were surveyed, and their merits were assessed to serve as a vision for the future of SiC power packaging. Current efforts pursuing 3D wire bondless SiC power modules were described, and the concept for a novel SiC power module was discussed.

show abstract

“…The module undergoes high thermal and thermo-mechanical stresses at high temperatures leading to critical failures in the system [135,136]. Degradation of polymeric materials used in the module packaging as well as the creation of intermetallic compounds, which may weaken the joints also occur at high temperatures [124,137,138].…”

Section: Electro Chemical Double Layermentioning

confidence: 99%

Integrated motor drives: state of the art and future trends

2017

IET Electric Power Applications

View full text Add to dashboard Cite

With increased need for high power density, high efficiency and high temperature capabilities in aerospace and automotive applications, integrated motor drives (IMD) offers a potential solution. However, close physical integration of the converter and the machine may also lead to an increase in components temperature. This requires careful mechanical, structural and thermal analysis; and design of the IMD system. This study reviews existing IMD technologies and their thermal effects on the IMD system. The effects of the power electronics position on the IMD system and its respective thermal management concepts are also investigated. The challenges faced in designing and manufacturing of an IMD along with the mechanical and structural impacts of close physical integration is also discussed and potential solutions are provided. Potential converter topologies for an IMD like the matrix converter, two-level bridge, three-level neutral point clamped and multiphase full bridge converters are also reviewed. Wide band gap devices like silicon carbide and gallium nitride and their packaging in power modules for IMDs are also discussed. Power modules components and packaging technologies are also presented. IntroductionOver the last two decades there has been a shift from traditional physically separated motor and drive systems to more compact, power dense, motor-drive combinations [1]. This new power-dense motor-drive structure combines both the motor and its associated control and drive circuitry within a single enclosure. The earliest records of commercially available motor-drive systems were manufactured by Grundfos in 1991 and Franz Morat KG in 1993 [2].These compact systems have been called a variety of names from 'smart motors' to 'integrated motors', the latter forming the foundation for the new moniker currently identified with these systems [3]. The term 'integrated motor drive (IMD)' is the latest associated with this class of products and is as a result of the success of a TB Woods Inc. manufactured motor-drive registered under the same name [3].IMDs are increasingly being developed and produced by machine manufacturers due to the significant potential benefits they offer. The most significant of these benefits include direct replacement of inefficient direct on line motors, increased power density, lower losses and lower costs compared with separate motor and drive solutions. Technological advancements over the last decade have led to the development of robust electronic components able to withstand the harsh environments required by some forms of integration [4]. By eliminating separate enclosures and long cable runs, the integrated approach promises to lower system costs by 20 to 40% [5].Elimination of transmission cables has economic advantages, including increased reliability due to the removal of the output filter commonly required for long cables. Removal of long cable runs and integration into a single package will also significantly reduce potential electromagnetic interference (EMI). This a...

show abstract

Development of an extreme temperature range silicon carbide power module for aerospace applications

Cited by 40 publications

References 4 publications

The Past, Present, and Future of Power Electronics Integration Technology in Motor Drives

The Past, Present, and Future of Power Electronics Integration Technology in Motor Drives

High Performance Silicon Carbide Power Packaging—Past Trends, Present Practices, and Future Directions

Integrated motor drives: state of the art and future trends

Contact Info

Product

Resources

About