2006
DOI: 10.1002/pssa.200565320
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Development of AlInGaN based blue–violet lasers on GaN and SiC substrates

Abstract: We present a process for high quality InGaN laser diodes on free standing GaN substrates with high reproducibility. We demonstrate a self‐aligned process to contact lasers with ridge width <2 μm. The stability of the process allows us to optimize the epitaxial structure on GaN substrates and we achieve cw‐threshold current densities of 2.9 kA/cm2 for 10 μm wide ridges and 4.7 kA/cm2 for 1.5 μm wide ridges. Cw‐slope efficiencies of 1.0 W/A are achieved for both widths. Beside this we notice a reduction of the i… Show more

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Cited by 22 publications
(11 citation statements)
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“…This tilted angle was adopted to minimize the reflectance from the front facet of the SLD without antireflection coatings (AR) [30], while the back facet is coated with a dielectric high-reflective (HR) mirror with >90% reflectivity in order to increase the output power. Conventional LD fabrication steps were used in a commercial epitaxial structure consisting of a c-plane GaN substrate, AlGaN p-and n-type cladding layers, InGaN active region with multiple quantum wells, p-AlGaN electron blocking layer, highly Mg-doped p-GaN contact layer and GaN waveguides similar to previous reported structures [31].…”
Section: Methodsmentioning
confidence: 99%
“…This tilted angle was adopted to minimize the reflectance from the front facet of the SLD without antireflection coatings (AR) [30], while the back facet is coated with a dielectric high-reflective (HR) mirror with >90% reflectivity in order to increase the output power. Conventional LD fabrication steps were used in a commercial epitaxial structure consisting of a c-plane GaN substrate, AlGaN p-and n-type cladding layers, InGaN active region with multiple quantum wells, p-AlGaN electron blocking layer, highly Mg-doped p-GaN contact layer and GaN waveguides similar to previous reported structures [31].…”
Section: Methodsmentioning
confidence: 99%
“…Our self aligned process for structuring ridge widths of 1.5 to 2.5 µm is described elsewhere [2]. We want to mention that we see advantages using absorbers on the GaN surface compared to earlier publications using absorbers on the top of the passivation layer [3].…”
Section: Methodsmentioning
confidence: 98%
“…The wafers were processed as ridge-wave-guide lasers with structuring the ridge-width of 1.5µm to 2.5µm by a selfaligned process, which is described elsewhere [8]. The ridge is structured by reactive ion etching and the devices are passivated with an insulating material like SiO 2 .…”
Section: Methodsmentioning
confidence: 99%