Development of a capacitive ultrasonic sensor having parylene diaphragm and characterization of receiving performance of arrayed device

Aoyagi, Shigeaki; Furukawa, Katsuhide; Ono, Daisuke; Ymashita, Kaoru; Tanaka, Takashi; Inoue, Koji; Okuyama, Masanori

doi:10.1016/j.sna.2007.10.060

Cited by 6 publications

(4 citation statements)

References 13 publications

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“…As the third aim of this research, an arrayed sensor device comprising 5×5 developed sensors is fabricated, and its receiving performance is characterized to prove the possibility of the electrical scanning of directivity based on delay-and-summation principle (Aoyagi et al, 2008a). As the fourth aim of this research, we confirm that each developed sensor can act as a transmitter by applying a high impulsive voltage, which means that the scanning of transmitting directivity is also possible.…”

Section: ＋＋＋＋＋＋＋＋＋ ---------supporting

confidence: 52%

Solid State Circuits Technologies

Swart¹

2010

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he continued as collaborating professor at FEEC/UNICAMP. His experience is in the field of Electrical Engineering, with emphasis in materials and semiconductor devices, mainly on the following subjects: Si and GaAs integrated circuit technologies, CMOS, HBT, thin films, plasma etching and nanoelectronics. He was president of the Brazilian Microelectronics Society for two terms. He was member of CA-EE of CNPq for two terms and also member of the Deliberative Council of CNPq for 4 years. He is Distinquished Lecturer, chair of EDS Subcommittee for Regions/Chapters (SRC) for Region 9 and elected member of the Board of Governors of the Electron Device Society of IEEE. He is Fellow of IEEE.

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Section: ＋＋＋＋＋＋＋＋＋ ---------supporting

confidence: 52%

Solid State Circuits Technologies

Swart¹

2010

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“…For loading conditions, the chromium layer was modeled with the nominal tensile intrinsic stress that is given in Table 1 for each test sample. Additionally an intrinsic stress of 25 MPa (Aoyagi et al (2008), Zopfl et al (2009)) was included in the parylene-C layer due to stresses developed during the deposition process. …”

Section: Finite Element Analysismentioning

confidence: 99%

New Method to Measure Tensile Strength of Low Modulus Thin Films

Ginga

Sitaraman

2011

Int J Fract

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In this study, we present a new fracture testing technique that can be used to determine the tensile strength of low strength thin films. This test utilizes standard photolithography processes to fabricate test samples and to perform the test. Finite element analysis is then used to extract tensile strength from the experimental data. This technique is demonstrated by measuring tensile strength values for parylene-C thin films. The polymer parylene-C is commonly deposited as a thin film and used in a wide range of applications, but few reports have been presented on its mechanical properties. Test samples were fabricated on glass slides with 100 nm of SiO 2 and 1 m or 3.64 m of parylene-C. The tensile strength of parylene-C was determined to be in the range of 57 MPa by using finite element analysis to extract the tensile strength from the experimental data.

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“…The directivity of the sensor is also the important issue in these applications. The second aim of this research is to characterize the fabricated Parylene ultrasonic receiver from the viewpoints of the accuracy of distance measurement and the directivity (Aoyagi et al, 2007a As the third aim of this research, an arrayed sensor device comprising 5×5 developed sensors is fabricated, and its receiving performance is characterized to prove the possibility of the electrical scanning of directivity based on delay-and-summation principle (Aoyagi et al, 2008a). As the fourth aim of this research, we confirm that each developed sensor can act as a transmitter by applying a high impulsive voltage, which means that the scanning of transmitting directivity is also possible.…”

Section: Introductionmentioning

confidence: 99%

Development of a capacitive ultrasonic sensor having parylene diaphragm and characterization of receiving performance of arrayed device

Cited by 6 publications

References 13 publications

Solid State Circuits Technologies

Solid State Circuits Technologies

New Method to Measure Tensile Strength of Low Modulus Thin Films

Micromachined Arrayed Capacitive Ultrasonic Sensor/Transmitter with Parylene Diaphragms

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