Abstract:In this study, we present a new fracture testing technique that can be used to determine the tensile strength of low strength thin films. This test utilizes standard photolithography processes to fabricate test samples and to perform the test. Finite element analysis is then used to extract tensile strength from the experimental data. This technique is demonstrated by measuring tensile strength values for parylene-C thin films. The polymer parylene-C is commonly deposited as a thin film and used in a wide rang… Show more
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