Detailed film coefficient measurement on a simple large-scale semiconductor package geometry

Boyle, M.T.; Asante, Kofi

doi:10.1109/stherm.1990.68496

Cited by 4 publications

(3 citation statements)

References 14 publications

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“…Fan-generated flows contain swirling flow patterns [44], while screen holes will produce jets downstream [24,45]. Such flow disturbances can generate unsteady or transitional flow conditions over electronic circuit boards, with attaching, separating and recirculating flow features [60], In addition, the component topology often generates multi-dimensional flow phenomena that include pulsating and vortical structures [60,61]. Airflows over component-boards are usually classified as low-Reynolds number flows due to the small velocities and geometric length scales encountered [62].…”

Section: Prediction Of Electronic Component Operational Temperaturementioning

confidence: 99%

“…Recognising the complexity o f the flow phenomena [58,[84][85][86] and conjugate heat transfer processes associated with real PCBs [87,88], experimental studies sought to simplify the representation of the populated PCB geometry and the associated heat transfer processes.…”

Section: Experimental Characterisation Of Air-cooled Electronic Compomentioning

confidence: 99%

“…These studies provide excellent descriptions o f the flow phenomena about classical geometries such as two-dimensional ribs [95] and cubical elements [62,116,117,91], or the flat pack geometries considered in this study [61,84,118 …”

Section: Experimental Flow Visualisationmentioning

confidence: 99%

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An Experimental Assessment of Computational Fluid Dynamics Predictive Accuracy for Electronic Component Operational Temperature

Eveloy¹,

Rodgers²,

Hashmi

2003

Heat Transfer: Volume 3

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The flow modeling approaches employed in Computational Fluid Dynamics (CFD) codes dedicated to the thermal analysis of electronic equipment are generally not specific for the analysis of forced airflows over populated Printed Circuit Boards. This limitation has been previously highlighted [1], with component junction temperature prediction errors of up to 35% reported. This study evaluates the predictive capability of candidate turbulence models more suited to the analysis of electronic component heat transfer. Significant improvements in component junction temperature prediction accuracy are obtained, relative to a standard high-Reynolds number k-e model, which are attributed to better prediction of both board leading edge heat transfer and component thermal interaction. Such improvements would enable parametric analysis of product thermal performance to be undertaken with greater confidence in the thermal design process, and the generation of more accurate temperature boundary conditions for use in Physics-of-Failure based reliability prediction methods. The case is made for vendors of CFD codes dedicated to the thermal analysis of electronics to consider the adoption of eddy viscosity turbulence models more suited to board-level analysis.

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Section: Prediction Of Electronic Component Operational Temperaturementioning

confidence: 99%

Section: Experimental Characterisation Of Air-cooled Electronic Compomentioning

confidence: 99%

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An Experimental Assessment of Computational Fluid Dynamics Predictive Accuracy for Electronic Component Operational Temperature

Eveloy¹,

Rodgers²,

Hashmi

2003

Heat Transfer: Volume 3

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show abstract

Visualization of forced air flows over a populated printed circuit board and their impact on convective heat transfer

Lohan¹,

Eveloy²,

Rodgers³

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)

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1996 cumulative bibliography of articles on semiconductor thermal measurement, management and modeling

Siegal

Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings

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Detailed film coefficient measurement on a simple large-scale semiconductor package geometry

Cited by 4 publications

References 14 publications

An Experimental Assessment of Computational Fluid Dynamics Predictive Accuracy for Electronic Component Operational Temperature

An Experimental Assessment of Computational Fluid Dynamics Predictive Accuracy for Electronic Component Operational Temperature

Visualization of forced air flows over a populated printed circuit board and their impact on convective heat transfer

1996 cumulative bibliography of articles on semiconductor thermal measurement, management and modeling

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