Visualization of forced air flows over a populated printed circuit board and their impact on convective heat transfer

Lohan, John; Eveloy, Valérie; Rodgers, Peter

doi:10.1109/itherm.2002.1012498

Cited by 12 publications

(7 citation statements)

References 18 publications

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“…[16,20]. The variation in accuracy with airflow velocity possibly reflects changes in the flow conditions, experimentally visualised in [13,23], to which the flow models display different sensitivity. Although not presented due to space constraints, excellent agreement was also obtained between measured and predicted component-PCB surface temperature profiles in free convection conditions, both in the span-wise and stream-wise airflow directions [13,24].…”

Section: Steady-state Heat Transfermentioning

confidence: 99%

Application of numerical analysis to the optimisation of electronic component reliability screening and assembly processes

Eveloy¹,

Rodgers²,

Hashmi

2004

Journal of Materials Processing Technology

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Section: Steady-state Heat Transfermentioning

confidence: 99%

Application of numerical analysis to the optimisation of electronic component reliability screening and assembly processes

Eveloy¹,

Rodgers²,

Hashmi

2004

Journal of Materials Processing Technology

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“…The heat transfer properties of the flows visualized over the boards were assessed using a paint-film evaporative method in [25], [35], which enabled regions of high convective heat transfer to be highlighted.…”

Section: A Airflow Visualizationmentioning

confidence: 99%

“…This is highlighted by Ferziger and Peric [37] who caution on the applicability of wall functions when such flow features exist over a large portion of the wall boundaries, and point out that serious modeling errors may result. These flow conditions however are typical of populated PCBs [7], [35]. Overall therefore, using the standard k-turbulence model with wall function treatment, prediction accuracy for component-PCB surface heat transfer coefficient will depend both on how far the flow conditions deviate from boundary layer flow, and on the sensitivity of heat transfer to these conditions.…”

Section: ) For Multi-component Pcb Applications Analyzed In Iso-mentioning

confidence: 99%

“…4) Until flow modeling is improved in CFD codes dedicated to the thermal analysis of electronics, the use of flow visualization on mock-up prototypes in the early design phase can help identify aerodynamically sensitive regions on the board, where temperature predictions should be considered with caution. The experimental methods and approach advocated are described in [20], [35], [43]. 5) The computational grid volumes required in this study, on order 4 million grid cells, would be considered impractical in a design environment.…”

Section: ) For Multi-component Pcb Applications Analyzed In Iso-mentioning

confidence: 99%

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Numerical Prediction of Electronic Component Operational Temperature: A Perspective

Eveloy¹,

Rodgers

Hashmi

2004

IEEE Trans. Comp. Packag. Technol.

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This study aims to provide a perspective on the current capabilities of computational fluids dynamics (CFD) as a design tool to predict component operational temperature in electronic systems. A systematic assessment of predictive accuracy is presented for printed circuit board (PCB)-mounted component heat transfer, using a CFD code dedicated to the thermal analysis of electronic systems. Component operating temperature predictive accuracy ranges from +3 C to 22 C (up to 35%) of measurement, depending on component location on the board, airflow velocity and flow model applied. Combined with previous studies, the results highlight that component junction temperature needs to be experimentally measured when used for strategic product design decisions and reliability predictions. Potential development areas are discussed for improved analysis.

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“…Airflow visualisations performed over the SEMI PCB using a paint-flow method by Lohan et al [223], are also presented.…”

Section: Experimental Airflow Visualisationmentioning

confidence: 99%

An Experimental Assessment of Computational Fluid Dynamics Predictive Accuracy for Electronic Component Operational Temperature

Eveloy¹,

Rodgers²,

Hashmi

2003

Heat Transfer: Volume 3

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The flow modeling approaches employed in Computational Fluid Dynamics (CFD) codes dedicated to the thermal analysis of electronic equipment are generally not specific for the analysis of forced airflows over populated Printed Circuit Boards. This limitation has been previously highlighted [1], with component junction temperature prediction errors of up to 35% reported. This study evaluates the predictive capability of candidate turbulence models more suited to the analysis of electronic component heat transfer. Significant improvements in component junction temperature prediction accuracy are obtained, relative to a standard high-Reynolds number k-e model, which are attributed to better prediction of both board leading edge heat transfer and component thermal interaction. Such improvements would enable parametric analysis of product thermal performance to be undertaken with greater confidence in the thermal design process, and the generation of more accurate temperature boundary conditions for use in Physics-of-Failure based reliability prediction methods. The case is made for vendors of CFD codes dedicated to the thermal analysis of electronics to consider the adoption of eddy viscosity turbulence models more suited to board-level analysis.

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Visualization of forced air flows over a populated printed circuit board and their impact on convective heat transfer

Cited by 12 publications

References 18 publications

Application of numerical analysis to the optimisation of electronic component reliability screening and assembly processes

Application of numerical analysis to the optimisation of electronic component reliability screening and assembly processes

Numerical Prediction of Electronic Component Operational Temperature: A Perspective

An Experimental Assessment of Computational Fluid Dynamics Predictive Accuracy for Electronic Component Operational Temperature

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