“…There are a number of reasons that make this importance evident, and that have been pointed out by Lasance [1]: First, at the component level, the designers cause an increase in the power density as a result of the reduction of the packaging, therefore, the reduction of the thermal resistance between the heat sources and the casing is especially important. One of the first fields in which this need took place was in aeronautics [2], especially at the military level, but with the introduction of the electric mobility and the need to use it inside the limited space at the powerful direct current in direct current (DC-DC) converters [3] and batteries with high discharge rates [4], thermal management is reaching workaday objects. In addition, according to the international roadmap for devices and systems [5], the forthcoming introduction of semiconductor architectures in 2.5D and 3D, which seeks to approximate to the ideal transistor concept, will be one of the greatest short-term challenges of the semiconductor industry because of the difficulty of extracting heat from the die stack.…”