Design of inductors in organic substrates for 1-3 GHz wireless applications

Dalmia, S.; Ayazi, Farrokh; Swaminathan, Madhavan; Min, Sung Hwan; Lee, Seock Hee; Kim, Woopoung; Kim, Dong–Su; Bhattacharya, Swapan Kumar; White, G. Edward; Tummala, Rao

doi:10.1109/mwsym.2002.1012118

Cited by 24 publications

(18 citation statements)

References 7 publications

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“…It is also limited to large area manufacturing. Thus, several studies have been performed to realize the embedded inductors onto organic substrates due to their advantages such as low cost fabrication, large area manufacturing, and system level packaging [8]- [10]. However, these inductors are limited to use in the advanced electronic products with small size/volume, low profile, and high packaging density since they have been fabricated on the first layer of the organic substrate at which IC chips, sensors, and other devices are placed and assembled.…”

Section: Introductionmentioning

confidence: 99%

Characterization of Fully Embedded RF Inductors in Organic SOP Technology

Lee

Park

2009

IEEE Trans. Adv. Packag.

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In this paper, we investigate fully embedded circular spiral inductors in multilayered organic packaging substrate for radio-frequency (RF) and microwave applications. The proposed spiral inductors are designed with circular geometry to improve their quality factors and the vertically stacked geometry is utilized to reduce the component area resulting in the increment of packaging density. And also the embedded circular spiral inductors are designed with conductor backed coplanar waveguide (CBCPW) structures for utilizing them directly for compact RF modules and systems. They are evaluated and optimized by varying their geometry parameters such as a number of turns, inner diameter, and embedded layer. These embedded inductors are accurately designed and analyzed by 3-D EM simulation and equivalent circuit modeling. The planar circular spiral two-turn inductor has inductance of 8.6 nH and maximum quality factor of 67 at 1 GHz. The vertically stacked circular spiral two-turn inductor has inductance of 10.2 nH and maximum quality factor of 66 at 1 GHz. The size of the vertically stacked inductor is approximately 70% of the planar one. The measured performance characteristics are well matched with the 3-D EM simulated ones.Index Terms-Circular spiral, embedded, inductor, organic substrate, packaging density, quality factor, stacked spiral, system on packaging (SOP).

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Section: Introductionmentioning

confidence: 99%

Characterization of Fully Embedded RF Inductors in Organic SOP Technology

Lee

Park

2009

IEEE Trans. Adv. Packag.

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“…Several techniques for fabricating planar transformer using standard CMOS RF IC technology have been developed, including using highly resistive substrate or thick low-K dielectrics film (Arshak 1999;Dalmia et al 2002;Wu et al 2000;Yoon et al 1999). In term of micromachining techniques, metal ground shield (Jiang et al 2002), thick metal traces (Yue and Wong 1998), thick oxide and suspended coil spiral over silicon trench (Ribas et al 2000;Jiang et al 2000) and out of plane coil structure (Jolic et al 2003) have been used to reduce the parasitic effects.…”

Section: Introductionmentioning

confidence: 99%

Surface micromachined on-chip transformer fabricated on glass substrate

2008

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On-chip micro-transformer on high resistive glass substrate has been developed. The transformer consists of stacked spiral coil with square interwinding coil structure which is fabricated using surface micromachining technique. The performance of the micro-transformer is illustrated through low and high frequency measurements. The characteristics of glass based transformer are compared with conventional Si-based micro-transformer. The results show that the RF performance of the glass-based transformer is improved compared to that of silicon-based transformer. The process fabrication of the device is simple, highlighting a good prospect for the future threedimensional RF-MEMS device application.

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“…Variants of this design schematic have been. demonstrated in [2,3,7,and 91. This paper further extends by adding lowpass filter elements at the input and output to achieve high attenuation at the second harmonic and third harmonic of the center frequency.…”

Section: Design Of Filtersmentioning

confidence: 99%

“…Using the resonant property of lumped capacitors C1 and C2, which resonate with parasitic inductances LC1 and LC2 respectively, could also do this. For simplicity the only parasitic [7,8,12,and 131 by the authors were used as the guidelines for the design of stand alone components. Inductors in the range of 1nH-lOnH [7,8] can be embedded in stripline, CPW, microstrip or a combination of the above with Qs in the range of 30-200 based on the topology and configuration used.…”

Section: Design Of Filtersmentioning

confidence: 99%

“…For simplicity the only parasitic [7,8,12,and 131 by the authors were used as the guidelines for the design of stand alone components. Inductors in the range of 1nH-lOnH [7,8] can be embedded in stripline, CPW, microstrip or a combination of the above with Qs in the range of 30-200 based on the topology and configuration used. Using low loss (~=2.9, tan 6=0.002 below 10GHz) lmil thick LCP for embedded parallel plate capacitors or inter-digital capacitors helps achieve unloaded Q>200 for capacitances in the range of 0.1-5pF for fiequencies >2GHz with capacitance densities on the order of 2pF/mmz.…”

Section: Design Of Filtersmentioning

confidence: 99%

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Liquid crystalline polymer (LCP) based lumped-element bandpass filters for multiple wireless applications

Dalmia

White²,

Swaminathan³

2004 IEEE MTT-S International Microwave Symposium Digest (IEEE Cat. No.04CH37535)

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This paper presents for the first time the design, implementation, measurements and reliability data of multiple RF filters on Liquid Crystalline Polymer based substrates for different communication standards such as 802.11 a/b/g, LMDSMMDS, cellular and Bluetooth applications. The first examples of this platform substrate technology are very compact 12mm3 fully packaged SMT front-end filters with center frequencies of 2.45 and 5.775 GHz. One embodiment of the filter at 2.45 GHz, which is well suited for 802.11 blg and Bluetooth type applications, provides a passband of 100 MElz with maximum inband insertion loss less than 2dB at 25OC, greater than 25dB attenuation at 2700-2800 MHz, greater than lOdB attenuation below 2.2GHz, greater than 20dB rejection at the second and third harmonic and inband VSWR less than 1.5 matched to 50 Ohms at the input and output. Index Terms -Bandpass Filters, Chip-type component, embedded passives, lumped element microwave circuits resonators, multilayer organic (MLO), multilayer RF circuits, packaging, printed circuit board (PCB).

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Design of inductors in organic substrates for 1-3 GHz wireless applications

Cited by 24 publications

References 7 publications

Characterization of Fully Embedded RF Inductors in Organic SOP Technology

Characterization of Fully Embedded RF Inductors in Organic SOP Technology

Surface micromachined on-chip transformer fabricated on glass substrate

Liquid crystalline polymer (LCP) based lumped-element bandpass filters for multiple wireless applications

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