Liquid crystalline polymer (LCP) based lumped-element bandpass filters for multiple wireless applications

Abstract

This paper presents for the first time the design, implementation, measurements and reliability data of multiple RF filters on Liquid Crystalline Polymer based substrates for different communication standards such as 802.11 a/b/g, LMDSMMDS, cellular and Bluetooth applications. The first examples of this platform substrate technology are very compact 12mm3 fully packaged SMT front-end filters with center frequencies of 2.45 and 5.775 GHz. One embodiment of the filter at 2.45 GHz, which is well suited for 802.11 blg and Bluetooth type applications, provides a passband of 100 MElz with maximum inband insertion loss less than 2dB at 25OC, greater than 25dB attenuation at 2700-2800 MHz, greater than lOdB attenuation below 2.2GHz, greater than 20dB rejection at the second and third harmonic and inband VSWR less than 1.5 matched to 50 Ohms at the input and output. Index Terms -Bandpass Filters, Chip-type component, embedded passives, lumped element microwave circuits resonators, multilayer organic (MLO), multilayer RF circuits, packaging, printed circuit board (PCB).

3d Lumped Components and Miniaturized Bandpass Filter in an Ultra-Thin M-LCP for Sop Applications

“…LCP has been used in single layers since 2004 [9]. Despite its excellent properties for RF circuits, not many designs have been reported until recently.…”

Novel nanomagnetic materials for high-frequency RF applications

“…However, traditional organic materials such as epoxies have high losses at high frequencies, making them extremely difficult to build high-performance front-end modules. Stringent thermal stability and ultra-low loss requirements confine the choice of passive component materials to relatively few polymers such as Liquid Crystal Polymer (LCP), Bisbenzocyclobutene (BCB) and Poly tetrafluoroethylene (PTFE) [7,8]. The low dielectric constant of these materials leads to relatively larger component designs and is a major barrier for miniaturization and performance of wireless interfaces.…”

High Performance and Compact Balanced-Filter Design for WiMAX Front-End Modules (FEM) Using LCP-Based Organic Substrates

“…This FEM was designed using LCP-based organic substrate. Recent developments in LCP-based processing technology have made LCP a promising technology for reliable SOP applications at RF and microwave frequencies [5]. Electrical characteristics such as (a) low and stable dielectric constant and low loss up to microwave frequencies, and (b) low moisture absorption for dimensional stability and high temperature tolerance make it usable in harsh environments.…”

“…Electrical characteristics such as (a) low and stable dielectric constant and low loss up to microwave frequencies, and (b) low moisture absorption for dimensional stability and high temperature tolerance make it usable in harsh environments. The entire process is compatible with standard printed wiring board infrastructure [5]. All baluns and filters are designed 1-4244-0688-9/07/$20.00 C 2007 IEEE using internal layers, while PA and SPDT dies are located on top layer connected with wire bonding.…”