2018
DOI: 10.1007/s10853-018-2707-4
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Design of electrical probe memory with TiN capping layer

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Cited by 10 publications
(17 citation statements)
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“…To prove this, some preliminary studies were performed to assess the role of the layered thickness and electrothermal properties of TiN films on the writing performance of the phase-change electrical probe memory [ 36 ], as shown in Figure 10 .…”
Section: Design Approaches Review Of Phase-change Electrical Probementioning
confidence: 99%
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“…To prove this, some preliminary studies were performed to assess the role of the layered thickness and electrothermal properties of TiN films on the writing performance of the phase-change electrical probe memory [ 36 ], as shown in Figure 10 .…”
Section: Design Approaches Review Of Phase-change Electrical Probementioning
confidence: 99%
“…Encouraged by Wright’s findings, a parametric approach has most recently been developed by Wang et al to calculate the maximum/minimum temperature at some pre-defined points that would intensely affect the resulting density, energy consumption [ 36 ], and device thermal stability by adjusting the geometrical and electro-thermal properties of the layered architecture including TiN capping, GST media, and TiN bottom electrode. The optimized trilayer stack is therefore established to be a 2 nm GST layer sandwiched by a 2 nm TiN capping with an electrical conductivity of 2 × 10 5 Ω −1 ⋅m −1 and a thermal conductivity of 12 W⋅m −1 ⋅K −1 , and a 40 nm TiN bottom electrode with an electrical conductivity of 2 × 10 6 Ω −1 ⋅m −1 and a thermal conductivity of 12 W⋅m −1 ⋅K −1 , deposited on Si substrate, giving rise to a cylindrical crystalline bit by a 5 V pulse of 180 ns, and a semi-elliptical amorphous bit by a 6.5 V pulse of 200 ns, as shown in Figure 21 .…”
Section: Current Status Of Phase-change Electrical Probe Memorymentioning
confidence: 99%
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