Design of a bent beam electrothermal actuator for in situ tensile testing of ceramic nanostructures

Pantano, Maria F.; Pugno, Nicola

doi:10.1016/j.jeurceramsoc.2013.12.001

Cited by 10 publications

(4 citation statements)

References 26 publications

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“…In the case of MEMS devices, such ability can be readily available if the sensor geometry can change significantly during the tensile test. For example, sensors with a v-shaped geometry, like the amplifier reported in Pantano and Pugno (2014), have a stiffness depending on the length and inclination angle of their chevron beams. In particular, as the test proceeds and this kind of sensor is deformed, both the length and inclination angle of chevron beams change with a consequent stiffness increase.…”

Section: Analysis Of Results and Discussionmentioning

confidence: 99%

Load Sensor Instability and Optimization of MEMS-based Tensile Testing Devices

et al. 2019

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MEMS-based tensile testing platforms are very powerful tools for the mechanical characterization of nanoscale materials, as they allow for testing of micro/nano-sized components in situ electron microscopes. In a typical configuration, they consist of an actuator, to deliver force/displacement, and a load sensor, which is connected to the sample like springs in series. Such configuration, while providing a high resolution force measurement, can cause the onset of instability phenomena, which can later compromise the test validity. In the present paper such phenomena are quantitatively discussed through the development of an analytical model, which allows to find a relationship between the rise of instability and the sensor stiffness, which is the key parameter to be optimized.

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Section: Analysis Of Results and Discussionmentioning

confidence: 99%

Load Sensor Instability and Optimization of MEMS-based Tensile Testing Devices

et al. 2019

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“…The input displacement d at both ends of the V‐shaped lever has the following relationship with the output displacement D at the middle [18]:

\begin{matrix} right leftthickmathspace.5em \\ F & = k_{14} d + k_{44} D \\ k_{14} & = - \frac{E A_{4}}{L_{4}} \cos^{2} θ_{4} + 12 \frac{E I_{4}}{L_{4}^{3}} \cos θ_{4} \sin θ_{4} \\ k_{44} & = \frac{E A_{4}}{L_{4}} \sin^{2} θ_{4} + 12 \frac{E I_{4}}{L_{4}^{3}} \cos^{2} θ_{4} \end{matrix}

where

L_{4}

A_{4}

I_{4}

, and

θ_{4}

are the half beam length, cross‐sectional area, moment of inertia, and inclination angle of the V‐shaped lever. F is the vertical force acting on the central cross‐section of the V‐shaped lever, which can be approximated as

F = \frac{1}{2} k_{normals} D

The maximum output displacement

D_{\max}

in the middle of the V‐shaped lever should exceed the maximum deformation value of the energy storage beam corresponding to the largest gear of the lock structure

D_{\max} > normalΔ + N Δ_{1} + ()(, N - 1) Δ_{2}

It can be derived from formulas (3), (5), (6)–(8) that

…”

Section: Methodsmentioning

confidence: 99%

“…a is the thermal expansion coefficient of silicon. The input displacement d at both ends of the V-shaped lever has the following relationship with the output displacement D at the middle [18]:…”

Section: Experimentmentioning

confidence: 99%

On‐chip test method for in‐situ evaluating the impact resistance reliability of silicon microbeams

Cheng

Zhang

2020

Micro & Nano Letters

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To the best of the authors' knowledge, this Letter reports and validates for the first time an on-chip reseTable test method that can be used to in-situ evaluate the impact reliability of a process-related silicon microbeam. A test structure integrating impact generating device, test samples, and a lock module is proposed to evaluate the impact-resistant reliability of the process-related microbeam samples with only a common optical microscope and probe station in the fabrication line. A calculation model that uses the LS-Dyna module in the finite-element commercial software ANSYS to process the test results is proposed to obtain the numerical parameters of the impact resistance reliability of the microbeam specimen. The test structure can be manufactured using a variety of mainstream MEMS silicon processes, so it can characterise the impact reliability of silicon microbeam structures under various processes. The above three parts constitute a self-aligned, low-cost test method with automation potential, which can be used for large-scale characterisation of the impact resistance reliability of silicon microbeam structures on the fabrication line. Finally, beam specimens under three different process conditions were manufactured and successfully evaluated using this test method, which verified the rationality of this method.

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“…Thus, new tools have to be developed for assessing the mechanical behavior at the nanoscale. In recent years, very useful systems for tensile testing of micro-/nano-samples have been proposed based on micro-electro-mechanical systems (MEMS) technology [13][14][15][16][17][18][19][20][21][22]. These consist of miniaturized testing machines, with the unique advantage of being compatible with electron microscopes, which enable a realtime monitoring of the sample deformation.…”

Section: Introductionmentioning

confidence: 99%

A mechanical system for tensile testing of supported films at the nanoscale

et al. 2018

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Standard tensile tests of materials are usually performed on freestanding specimens. However, such requirement is difficult to implement when the materials of interest are of nanoscopic dimensions due to problems related to their handling and manipulation. In the present paper, a new device is presented for tensile testing of thin nanomaterials, which allows tests to be carried out on specimens initially deposited onto a macroscopic pre-notched substrate. On loading, however, no substrate effects are introduced, allowing the films to be freely stretched. The results obtained from a variety of thin metal or polymeric films are very promising for the further development of this technique as a standard method for nanomaterial mechanical testing.

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Design of a bent beam electrothermal actuator for in situ tensile testing of ceramic nanostructures

Cited by 10 publications

References 26 publications

Load Sensor Instability and Optimization of MEMS-based Tensile Testing Devices

Load Sensor Instability and Optimization of MEMS-based Tensile Testing Devices

On‐chip test method for in‐situ evaluating the impact resistance reliability of silicon microbeams

A mechanical system for tensile testing of supported films at the nanoscale

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