Design, materials and process for lead‐free assembly of high‐density packages

Smetana, Joe; Horsley, Rob; Lau, John H.; Snowdon, K.G.; Shangguan, Dongkai; Gleason, Jerry; Memis, Irv; Love, Dave; Dauksher, Walter; Sullivan, Bob

doi:10.1108/09540910410517068

Cited by 13 publications

(14 citation statements)

References 2 publications

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“…The desire of component manufacturers and other elements of the supply chain is to operate a single line of products, rather than dual lead-free and lead-based production [22], [23]. Furthermore, the exemptions will be subjected to periodic review by the EU legislative bodies, with the intent to progressively eliminate them [23].…”

Section: A Company's Compliance Strategymentioning

confidence: 99%

Are you ready for lead-free electronics?

Eveloy

Ganesan

Fukuda

et al. 2005

IEEE Trans. Comp. Packag. Technol.

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An expedient transition to lead-free electronics has become necessary for most electronics industry sectors, considering the European directives 1 other possible legislative requirements, and market forces [1], [2]. In fact, the consequences of not meeting the European July 2006 deadline for transition to lead-free electronics may translate into global market losses.Considering that lead-based electronics have been in use for over 40 years, the adoption of lead-free technology represents a dramatic change. The industry is being asked to adopt different electronic soldering materials [3], component termination metallurgies, and printed circuit board finishes. This challenge is accompanied by the need to requalify component-board assembly and rework processes, as well as implement test, inspection, and documentation procedures. In addition, lead-free technology is associated with increased materials, design, and manufacturing costs. 2 The use of lead-free materials and processes has also prompted new reliability concerns [1], as a result of different alloy metallurgies and higher assembly process temperatures relative to tin-lead soldering.This paper provides guidance to efficiently implement the lead-free transition process that accounts for the company's market share, associated exemptions, technological feasibility, product reliability requirements, and cost. Lead-free compliance, part and supplier selection, manufacturing, and education and training are addressed. The guidance is presented in the form of answers to key questions.

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Section: A Company's Compliance Strategymentioning

confidence: 99%

Are you ready for lead-free electronics?

Eveloy

Ganesan

Fukuda

et al. 2005

IEEE Trans. Comp. Packag. Technol.

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“…One of them is the void. More voids have been reported in the solder joints of BGA packages made with SnAgCu solder balled and SnPb solder paste [30] and made with SnPb solder balled and SnAgCu solder paste [61]. How the voids would affect the long-term solder joint reliability is unknown.…”

Section: Transition To Total Lead-free Manufacturingmentioning

confidence: 99%

“…Third, SnAgCu solder joints have more voids than SnPb. More voiding was observed when SnAgCu alloy was assembled with SnPb component finishes [19,61]. Fourth, the appearance between SnAgCu and SnPb is different.…”

Section: Lead-free Solder Alloysmentioning

confidence: 99%

Lead-free Solder Joint Reliability – State of the Art and Perspectives

Pan

Wang

Shaddock

2005

Journal of Microelectronics and Electronic Packaging

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There is an increasing demand in replacing tin-lead (Sn/Pb) solders with lead-free solders in the electronics industry due to health and environmental concern. The European Union recently passed a law to ban the use of lead in electronic products. The ban will go into effect in July of 2006. The Japanese electronics industry has worked to eliminate lead from consumer electronic products for several years. Although currently there are no specific regulations banning lead in electronics devices in the United States, many companies and consortiums are working on lead-free solder initiatives including Intel, Motorola, Agilent Technologies, General Electric, Boeing, NEMI and many others to avoid a commercial disadvantage.The solder joints reliability not only depends on the solder joint alloys, but also on the component metallization and PCB metallization. Reflow profile has significant impact on lead-free solder joint performance also because it influences wetting and microstructure of the solder joint. Majority researchers use temperature cycling for accelerated reliability testing since the solder joint failure mainly comes from thermal stress due to CTE mismatch. A solder joint failure could be caused by crack initiation and growth or by macroscopic solder facture.

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“…Though more voids were observed in forward compatibility assemblies for BGAs/CSPs [1], the reliability of forward compatibility assemblies is equivalent or better than the reliability of the SnPb balled BGAs with SnPb solder paste [2,25,32].…”

Section: Forward Compatibilitymentioning

confidence: 99%

“…7.4, a SnAgCu reflow profile is typically used. However, more voids were found in the forward compatibility solder joints [1,2]. The greater voiding in the solder joints has become a reliability concern [3].…”

Section: Challenges To Forward Compatibilitymentioning

confidence: 99%