Design Issues For Monolithic Gallium Arsenide On Silicon Devices

Christie, P.; Barnett, Allen; Hobart, Karl D.; Negley, Gerald H.

doi:10.1117/12.967512

Cited by 1 publication

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“…GaAs-on-silicon structures). The monolithic integration of GaAs devices provides a means of adding monolithic optical sources to the silicon circuitry [23,24,25,26,27]. The GaAs circuitry then provides an LED or preferably laser source as the driver of the optical interconnect.…”

Section: On-wafer (Monolithic or Hybrid Wsi) Optical Interconnectionsmentioning

confidence: 99%

Advanced interconnection technologies and system-level communications functions

Hornak

Tewksbury

Weidman³

et al.

Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference

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System communications is, to some extent, a system control mechanism, moderating events in one set of circuit functions according to events in other circuit functions located elsewhere in the system. The non-local behavior induced by interconnections therefore contrasts with the local behavior of nearby transistors within a simple circuit function. This non-locality (both in space and time) significantly complicates the relationship between the physical performance of interconnections and the system level functional performance provided by communications within a system. Despite this complication, higher performance interconnections and communications are increasingly important in extending digital electronics to higher levels of performance. Advanced system packaging and interconnection technologies are expected to provide more compact systems with higher interconnect data rates. For example, silicon wafer-level components relieve low level packaging/interconnect constraints while simultaneously providing a more interesting physical environment for introduction of new, high performance interconnection technologies. Assuming such high-density, multi-"chip" system integration, two examples of optical interconnections (one using a new polymer waveguide material and the other using free space, through-wafer interconnections) are provided to illustrate the potential role of advanced optical interconnects. The long term potentia1 impact of electrical interconnections using high-T, superconducors is briefly considered, drawing on our studies of a 31 cm microstrip transmission line. Rather than envisioning system advances driven by novel active devices, these examples suggest system performance advances driven by novel interconnect technologies overlaying conventional digital electronic circuitry.

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