Design and test of the bidirectional solid-state switch for an 160kV/9kA hybrid DC circuit breaker

Wei, Tongbo; Yu, Zhanqing; Chen, Zhengyu; Zhang, Xiangyu; Wen, Weijie; Huang, Yulong; Zeng, Rong

doi:10.1109/apec.2018.8341000

Cited by 16 publications

(9 citation statements)

References 15 publications

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“…A lot of emerging innovative HVDC CBs are under development or have commenced operation. The detailed current interruption technology, variety of topologies and key performance indicators of these HVDC CBs can be found in [4,7,11,15,16,[23][24][25][26][27][28][29][30]. With these many HVDC CBs flourishing, a unified standard to verify the performance of the equipment is necessary.…”

Section: Hvdc Cb Topologiesmentioning

confidence: 99%

Current interruption tests of HVDC circuit‐breakers: Requirements, methods and a testing case

Jia

Tang

Xiu

et al. 2022

IET Generation Trans & Dist

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Development towards HVDC grids is drawing intense development of HVDC circuit‐breakers (CBs). The increasing rated voltage and capacity requires HVDC CBs with excellent performance to be installed and comprehensive tests on HVDC CBs are indispensable. This paper contributes to clarifying clearer test requirements on the current interruption test, which is the most challenging one and proposing a novel applicable test method. It is the toughest test because when an HVDC CB interrupts fault current, a high transient interruption voltage (TIV) is produced by the operation of metal oxide surge arrester (MOSA), and a large current continues flowing through MOSA simultaneously, which means considerable energy is demanded for the test. To verify an HVDC CB's current interruption ability, voltage withstand ability and energy dissipation ability in single test can be costly and even impractical in extra high voltage classes. Alternatively, a multi‐part test method is reasonable and valuable, in which the HVDC CB can be tested with large current and high voltage one after another, while the energy dissipation ability will be verified separately. At last, a proposed synthetic test circuit is validated by a simulation and a low voltage experiment, creating high equivalence between the simulation and the validation test.

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Section: Hvdc Cb Topologiesmentioning

confidence: 99%

Current interruption tests of HVDC circuit‐breakers: Requirements, methods and a testing case

Jia

Tang

Xiu

et al. 2022

IET Generation Trans & Dist

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“…The surface of heatsinks is not flat hence the contact between heatsinks and power modules is not tight and effective. The warpage of contact electrodes of the press-pack IGBT module is produced and also leads to the uneven pressure distribution among parallel chips [21][22] which is different from the configuration in [14][15]. However, as the typical and common method to clamp the press-pack power modules in high power converter applications, the LPP packaging technology is chosen and the mechanical stress distribution is investigated in this paper.…”

Section: A Challenges To Mechanical Structure Of Lpp Power Stackmentioning

confidence: 99%

“…However, the lumped pressure contact will lead to uneven pressure distribution among the chips. In [14,Fig. 15] and [15,Fig.…”

Section: Introductionmentioning

confidence: 99%

Elastic Half-Space Theory-Based Distributed-Press-Pack Packaging Technology for Power Module With Balanced Thermal Stress

Chang

Luo

et al. 2021

IEEE J. Emerg. Sel. Topics Power Electron.

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In this paper, the distributed-press-pack (DPP) packaging technology is developed to achieve balanced thermal stress on the chips. Under the current lumped-press-pack (LPP) style, the mechanical stress distribution on the chips, which is inherently uneven and coupled with thermal stress distribution, can be described with elastic half-space theoretical model. By decentralizing the lumped pressing load and positioning the loads evenly, a matrix of clamping array is formulated and the mechanical stress distribution is compared under different clamping ways. Then, a 3*3 clamping method that meets the trade-off between balanced stress distribution and the packaging cost is chosen. Meanwhile, the busbar and heatsinks are integrated to improve the power density of the power module. Finally, a DPP prototype is implemented. By varying the pressure around the chips and heating them, the thermal distribution between parallel chips inside the prototype is compared and the effect of proposed elastic half-space theory based DPP packaging technology on the thermal stress balance is verified. 1

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“…The topology MT_b [5], which is the full‐bridge IGBT module, contains four IGBT modules and a snubber circuit of the capacitor. The topologies MT_c [19] and MT_d [20], which is a full‐bridge rectifier module, contains four diodes and two IGBT modules with RC or RCD snubber circuits, respectively. The topology MT_e is composed of two series‐connection IGBT stacks and four series‐connection diode stacks, where each IGBT level has its own RCD snubber circuit and each diode level has its own RC snubber circuit.…”

Section: Comprehensive Comparisons Of Different Hvss Topologiesmentioning

confidence: 99%

Research on the breaking branch for a hybrid DC circuit breaker in±500 kV voltage‐sourced converter high‐voltage direct current grid

Liu

Gou

Zhuo

et al. 2020

IET power electron.

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Design and test of the bidirectional solid-state switch for an 160kV/9kA hybrid DC circuit breaker

Cited by 16 publications

References 15 publications

Current interruption tests of HVDC circuit‐breakers: Requirements, methods and a testing case

Current interruption tests of HVDC circuit‐breakers: Requirements, methods and a testing case

Elastic Half-Space Theory-Based Distributed-Press-Pack Packaging Technology for Power Module With Balanced Thermal Stress

Research on the breaking branch for a hybrid DC circuit breaker in±500 kV voltage‐sourced converter high‐voltage direct current grid

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