Abstract:In this paper, the distributed-press-pack (DPP) packaging technology is developed to achieve balanced thermal stress on the chips. Under the current lumped-press-pack (LPP) style, the mechanical stress distribution on the chips, which is inherently uneven and coupled with thermal stress distribution, can be described with elastic half-space theoretical model. By decentralizing the lumped pressing load and positioning the loads evenly, a matrix of clamping array is formulated and the mechanical stress distribut… Show more
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