Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings
DOI: 10.1109/stherm.1996.545105
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Design and optimization of pin fin heat sinks for low velocity applications

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Cited by 25 publications
(6 citation statements)
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“…The cylindrical-shaped pins have the better heat transfer coefficient value than other pins shapes because there is a weak recirculation flow among them and give a share to contribute a fresh air in heat transfer. Pin-fin technology is classified as the most interesting methods for enhancing the exchange of heat [15] Heat sink with pin fin is extensively utilized because of it's not sensitive to the direction of air flow [16]. The pin fins arrangement are considered to be with uniform spacing (Z/D = X/D = 2.5) which has been tested by ref [17] to be one of the best fins arrangements.…”
Section: Mathematical Model Of Heat Sinksmentioning
confidence: 99%
“…The cylindrical-shaped pins have the better heat transfer coefficient value than other pins shapes because there is a weak recirculation flow among them and give a share to contribute a fresh air in heat transfer. Pin-fin technology is classified as the most interesting methods for enhancing the exchange of heat [15] Heat sink with pin fin is extensively utilized because of it's not sensitive to the direction of air flow [16]. The pin fins arrangement are considered to be with uniform spacing (Z/D = X/D = 2.5) which has been tested by ref [17] to be one of the best fins arrangements.…”
Section: Mathematical Model Of Heat Sinksmentioning
confidence: 99%
“…Shaukatullah et al [3] studied the optimal design of pin fin at low flow rates; the results showed that, with 6 × 6 cylindrical aluminum fins on a 25 mm × 25 mm base plate, a better cooling effect can be achieved by using 15 mm high pins with 1.5 × 1.5 mm cross section at 1 m/s flow rate of air.…”
Section: Introductionmentioning
confidence: 99%
“…There are lots of works related with various kinds of heat sink. In 1996, Shaukatullah et al [5] reported an optimized design of pin fin heat sink for use in low velocity applications where there is plenty of open space around for the air to bypass the heat sink. While, in 2002, Kim et al [6] investigated the thermal performance of several heat sinks such as extruded, aluminum foam, and layered one.…”
Section: Introductionmentioning
confidence: 99%