Design and Analysis of AlGaN/InGaN/GaN and InAlN/InGaN/GaN HEMTs for High-Power Wide Bandwidth Applications

Abstract

We present the stable transconductance operation of InGaN/GaN composite channel based HEMTs. LG = 55 nm AlGaN/InGaN/GaN (Device A) and InAlN/InGaN/GaN (Device B) HEMTs were proposed and investigated its operational characteristics using numerical simulation. Existence of deeper potential well, the proposed HEMTs possesses high 2DEG (two-dimensional electron gas) density, enhanced electron confinement, and improved electron mobility. As a result, the device shows enhanced current density, and high linearity operation. Furthermore, Al0.04Ga0.96N superlative back-barrier significantly reduces the buffer leakage current resulting in improved breakdown voltage (VBR). The proposed device A (device B) exhibited 2.81 (5) A/mm of output current density, 0.669 (0.7273) S/mm, 4 (7) V of GVS (gate voltage swing), 55.3 (43.5) V of breakdown voltage, and 252/263 (275/289) GHz of FT/FMAX. This excellent device performances illustrates the potential of InGaN/GaN channel HEMTs for future wide-band telecommunication, radio astronomy, radar and space applications.