2001
DOI: 10.1016/s0040-6090(01)01233-0
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Depth profiling and the effect of oxygen and carbon on the photoelectrical properties of amorphous silicon films deposited using tungsten wire filaments

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Cited by 7 publications
(2 citation statements)
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“…Thin silicon films were prepared using standard Hot-Wire Chemical Vapor Deposition (HWCVD) [6]. The silicon films (~ 100 nm to 5.5 µm) were deposited on Corning 7059 glass substrates, n-type silicon wafers <100>, and also on Cr, Mo, Ti, and V backplanes -of 100 nm thickness, prepared by sputtering on Corning 7059 glass substrates.…”
Section: Methodsmentioning
confidence: 99%
“…Thin silicon films were prepared using standard Hot-Wire Chemical Vapor Deposition (HWCVD) [6]. The silicon films (~ 100 nm to 5.5 µm) were deposited on Corning 7059 glass substrates, n-type silicon wafers <100>, and also on Cr, Mo, Ti, and V backplanes -of 100 nm thickness, prepared by sputtering on Corning 7059 glass substrates.…”
Section: Methodsmentioning
confidence: 99%
“…Our samples were grown by the HWCVD technique using a tungsten filament as a heating element (described elsewhere [18][19][20][21]). To grow nanocrystalline silicon, the hydrogen dilution of silane gas was held at H 2 /SiH 4 = 14, while the substrate temperature was kept constant at 200 • C during the growth.…”
Section: Growth Processmentioning
confidence: 99%