Deposition of hydrogen chloride gas on copper wafer depending on humidity and HCl concentration

Tran, Minh-Phuong; González-Aguirre, Paola; Beitia, C.; Lundgren, Jorgen; Moon, Sung-In; Fontaine, Hervé

doi:10.1016/j.mee.2019.01.001

Cited by 10 publications

(5 citation statements)

References 12 publications

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“…The properties of the four copper surfaces were revealed by XPS and were compared with previous experimental findings reported elsewhere in the literature [ 21 , 22 , 23 , 24 , 25 , 26 , 28 , 29 ]. The unheated (UH) copper surface consisted of both Cu (Cu 0 ) and Cu 2 O (Cu + ) ( Figure 4 and Table 4 ), gradually changing from Cu to Cu 2 O over time [ 4 , 24 , 26 ].…”

Section: Discussionmentioning

confidence: 94%

“…This absence of the satellite peaks suggested that the formed copper-oxide layer (oxide film) had been removed by HCl, as previously reported for a copper-containing gold–silver–palladium alloy [ 10 ]. The narrow-scan spectra ( Figure 4 and Table 4 ) suggested that CuCl 2 (Cu 2+ and Cl − ) and the gas-phase water (H 2 O) occurred by a chemical reaction between CuO and HCl [ 25 , 26 , 29 ]. The spectra in the Cu LMM region indicated that the AC specimen surface was not covered by CuO, and the surface consisted of CuO 2 , CuCl 2 , and Cu ( Figure 4 b and Table 4 ).…”

Section: Discussionmentioning

confidence: 99%

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Effects of Copper Surface Oxidation and Reduction on Shear-Bond Strength Using Functional Monomers

et al. 2021

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This study was conducted to clarify the influence of the copper surface oxidation and reduction on the shear-bond strength with functional monomers. Unheated copper specimens (UH; n = 88) were wet-ground. Three-quarters of the UH were then heated (HT). Two-thirds of the HT was then immersed in a hydrochloric acid solution (AC). Half of the AC was then reheated (RH). Each group was further divided into two groups (n = 11), which were primed by either 6-methacryloyloxyhexyl 2-thiouracil-5-carboxylate (MTU-6) or 10-methacryloyloxydecyl dihydrogen phosphate (MDP). The shear-bond strength tests were used for bonding with an acrylic resin. The surface roughness values and chemical states of the four groups were analyzed using a confocal scanning laser microscope and X-ray photoelectron spectroscopy (XPS). The shear-bond strengths of HT and RH were the lowest in the MTU-6-primed groups. The result of AC was significantly lower than others in the MDP-primed groups. The XPS results showed that the surfaces of UH and AC consisted of Cu2O and Cu. The surface changed to CuO upon heating. The presence or absence of copper-oxide films showed the opposite trends in the effectiveness of MTU-6 and MDP to improve bond strength. The results could elucidate the effects of functional monomers on copper-oxide films.

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Section: Discussionmentioning

confidence: 94%

Section: Discussionmentioning

confidence: 99%

Effects of Copper Surface Oxidation and Reduction on Shear-Bond Strength Using Functional Monomers

et al. 2021

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“…The source of these acidic contaminants may originate from processes bearing fluorine or chlorine chemistry. A recent study reported by Tran et al 18 clarifies the role of humidity and HCl concentration in the air played in the corrosion of copper-coated wafer surfaces. By controlling the exposure conditions with the relative humidity varying between <1% and 70% and HCl concentration between 20 ppbv and 450 ppbv, the investigators were able to establish an empirical correlation of surface chlorine deposition as a function of exposure time and concentration, independent of RH within the tested range:…”

Section: Current Knowledge About Amcsmentioning

confidence: 88%

Review—Airborne Molecular Contamination: Recent Developments in the Understanding and Minimization for Advanced Semiconductor Device Manufacturing

Den

Garza

et al. 2020

ECS J. Solid State Sci. Technol.

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This review paper focuses on the recent knowledge about airborne molecular contamination (AMC) and its impacts on 300-mm wafer fabrication processes. The adverse impacts on process materials by both organic and inorganic micro-contaminants, and evidence of cross-contamination between processed wafers and the mainstream wafer handling tools, are two areas of discussion for the study. The review also aims to re-frame the industrial guideline for AMC from chemical-based to risk-based approach, which substantiates the potential impacts of individual families of AMCs that have been well-documented. This approach resonates well with the new AMC classification method recently proposed by the International Roadmap of Devices and Systems (IRDS), building on new knowledge of AMC emerged over time with the advances of analytical and testing capability. The review also brings forth the impact of moisture, the mere presence of which can compromise the integrity of device structures. However, moisture is especially detrimental in the presence of other inorganic ions to trigger unwanted reactions with surface materials. Methods developed to minimize the micro-contaminants and moisture during wafer handling and storage are also reviewed.

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“…The release has little effect at low temperature, but it aggravates the release of HCl during combustion at medium-high temperature. At the same time, mixed burning of municipal solid waste will show a higher HCl release [16][17][18][19][20]. Municipal solid waste incineration will release a large number of HCl pollutant gas, not only will corrode the metal pipe wall, shorten the service life of the equipment, at the same time, in the presence of carbon sources will produce dioxin precursors, which seriously harm to life and ecological environment [21,22].…”

Section: Introductionmentioning

confidence: 99%

Effects of Municipal Solid Waste Torrefaction and Classification Pretreatment on Hydrogen Chloride Release

Hu¹,

Ning²,

Zhu³

et al. 2021

SJEE

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The incineration treatment of municipal solid waste is widely used, but gas-phase hydrogen chloride (HCl) generated during the incineration seriously threatens the heating surface of boiler tail, and even causes serious harm to environment. Through incineration experiments, this paper found that many factors (temperature, oxygen concentration, residence time and moisture content) affect the HCl emission characteristics in the process of municipal solid waste incineration treatment. In order to effectively cut back the HCl emission in incineration treatment of municipal solid waste, this paper proposes torrefaction and classification pretreatment of municipal solid waste. Torrefaction pretreatment has a significant inhibitory effect on HCl emission during the incineration of mixed municipal solid waste. At the same time, compared with the incineration treatment of mixed municipal solid waste, sawdust and plastic municipal solid waste of the same quality after classification pretreatment can effectively curb HCl emissions within the entire temperature range. In particular, HCl emissions are reduced by 35% during sawdust incineration treatment at 400°C. Furthermore, by studying the reaction mechanics of HCl generation during combustion at different temperatures, and the reaction rate of HCl generation is: mixed municipal solid waste >plastic >sawdust. Therefore, this paper believes that torrefaction and classification pretreatment of mixed municipal solid waste is beneficial to inhibit the precipitation of chlorine during the incineration process and promotes the resource utilization of municipal solid waste, which is of significant significance for energy conservation and emission reduction.

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Deposition of hydrogen chloride gas on copper wafer depending on humidity and HCl concentration

Cited by 10 publications

References 12 publications

Effects of Copper Surface Oxidation and Reduction on Shear-Bond Strength Using Functional Monomers

Effects of Copper Surface Oxidation and Reduction on Shear-Bond Strength Using Functional Monomers

Review—Airborne Molecular Contamination: Recent Developments in the Understanding and Minimization for Advanced Semiconductor Device Manufacturing

Effects of Municipal Solid Waste Torrefaction and Classification Pretreatment on Hydrogen Chloride Release

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