Effects of Copper Surface Oxidation and Reduction on Shear-Bond Strength Using Functional Monomers

Abstract

This study was conducted to clarify the influence of the copper surface oxidation and reduction on the shear-bond strength with functional monomers. Unheated copper specimens (UH; n = 88) were wet-ground. Three-quarters of the UH were then heated (HT). Two-thirds of the HT was then immersed in a hydrochloric acid solution (AC). Half of the AC was then reheated (RH). Each group was further divided into two groups (n = 11), which were primed by either 6-methacryloyloxyhexyl 2-thiouracil-5-carboxylate (MTU-6) or 10-methacryloyloxydecyl dihydrogen phosphate (MDP). The shear-bond strength tests were used for bonding with an acrylic resin. The surface roughness values and chemical states of the four groups were analyzed using a confocal scanning laser microscope and X-ray photoelectron spectroscopy (XPS). The shear-bond strengths of HT and RH were the lowest in the MTU-6-primed groups. The result of AC was significantly lower than others in the MDP-primed groups. The XPS results showed that the surfaces of UH and AC consisted of Cu2O and Cu. The surface changed to CuO upon heating. The presence or absence of copper-oxide films showed the opposite trends in the effectiveness of MTU-6 and MDP to improve bond strength. The results could elucidate the effects of functional monomers on copper-oxide films.

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Effect of Calcination Temperature on Cu-Modified Ni Catalysts Supported on Mesocellular Silica for Methane Decomposition

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