Deposition of hard thin films from HMDSO in atmospheric pressure dielectric barrier discharge

Abstract

To cite this version:DAbstract. The atmospheric pressure dielectric barrier discharge burning in nitrogen with small admixture of hexamethyldisiloxane (HMDSO) was used for the deposition of thin organosilicon films. The thin films were deposited on glass, silicon and polycarbonate substrates, the substrate temperature during the deposition process was elevated up to values within the range 25 • C -150 • C in order to obtain hard SiO x -like thin films. The properties of the discharge were studied by means of optical emission spectroscopy and electrical measurements. The deposited films were characterised by Rutherford backscattering and elastic recoil detection methods, x-ray photoelectron spectroscopy, infrared spectroscopy measurements, ellipsometry and depth sensing indentation technique. It was found that the films properties depend significantly on substrate temperature at deposition. An increase of substrate temperature from 25 • C to 150 • C leads to an increase of film hardness from 0.4 GPa to 7 GPa and the film chemical composition changes from CH x Si y O z to SiO x H y . The films were transparent in visible range.

Use of hexamethyldisiloxane for p-type microcrystalline silicon oxycarbide layers

“…This may result in the less desirable Si-O-H configuration, which is a deep electron trap [18,19]. HMDSO has already been used in the literature to deposit thermally stable SiO 2 layers [20] and dielectric barrier layers [21]. It was suggested that the Si-C bonds dissociate first and that the Si-O-Si bond remains intact during HMDSO decomposition in a plasma [22].…”

Tetrakis(trimethylsilyloxy)silane for nanostructured SiO2-like films deposited by PECVD at atmospheric pressure

“…Plasma enhanced chemical vapor deposition of silicon-organic films at atmospheric pressure (AP-PECVD) is commonly performed with a wide variety of precursors [15][16][17][18]. The most prominent class of precursors in use is alcoxysilanes (e.g.…”

Deposition of Polyacrylic Acid Films by Means of an Atmospheric Pressure Dielectric Barrier Discharge

“…A common property of DBDs is that in most gases at atmospheric pressure, breakdown is initiated in a large number of short-lived independent current filaments or microdischarges [32,35]. Because of this lack of uniformity, numerous efforts have been undertaken to homogenise DBDs and it has been found that under certain conditions homogeneous DBDs or so-called atmospheric pressure glow discharges (APGDs) can be obtained [36][37][38]. With respect to a uniform thin film deposition, a homogeneous discharge condition is very desirable, however, in practice, it is generally believed to be difficult and tricky to reliably control such homogeneous DBDs [39].…”