2000
DOI: 10.1016/s0040-6090(00)00761-6
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Deposition of a-SiC:H thin film from organosilicon material by remote plasma CVD method

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Cited by 13 publications
(8 citation statements)
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“…Although the presence of a (SiO) n  backbone is on the whole unquestionable, the occurrence of a few SiCH 2 Si bridges or SiCH 2 CH x  is possible. Indeed, recent papers on thin film deposition from hexamethyldisilane indicate that the IR spectrum of deposits exhibits a broad band at 1 020 cm −1 which has been ascribed to the Si(CH 2 ) n Si bridge (wagging mode 1 ≤ n ≤ 2) 12–14. Obviously, this deposit does not contain SiO bonds.…”
Section: Discussionmentioning
confidence: 93%
“…Although the presence of a (SiO) n  backbone is on the whole unquestionable, the occurrence of a few SiCH 2 Si bridges or SiCH 2 CH x  is possible. Indeed, recent papers on thin film deposition from hexamethyldisilane indicate that the IR spectrum of deposits exhibits a broad band at 1 020 cm −1 which has been ascribed to the Si(CH 2 ) n Si bridge (wagging mode 1 ≤ n ≤ 2) 12–14. Obviously, this deposit does not contain SiO bonds.…”
Section: Discussionmentioning
confidence: 93%
“…Sources frequently employed in PECVD process for the deposition of SiC films include silane/methane, 14 tetramethylsilane, 15 and hexamethyldisilane. 16 As mentioned in Ref. 16, pure silane is a good source for silicon, but it is an extremely hazardous material.…”
Section: Introductionmentioning
confidence: 99%
“…16 As mentioned in Ref. 16, pure silane is a good source for silicon, but it is an extremely hazardous material. Therefore, organosilicon sources containing Si and C as constituents, as in case of tetramethylsilane 15 and hexamethyldisilane 16 have been used for the deposition of SiC films.…”
Section: Introductionmentioning
confidence: 99%
“…Despite the lack of direct spectroscopic analysis of the Si/SiO 2 -polyphenylene interface, it is likely the covalent grafting relies on Si-C and/or Si-O-C bonds, while the bonds involved in the multilayer formation are either C-N or C-C bonds [36,37]. Our study indicates that the overall energy of the interfacial bonds (mainly Si-C and/or Si-O-C bonds at the Si/SiO 2 -polyphenylene interface) is stronger than the energy responsible for the cohesion of the multilayer structure.…”
Section: Resultsmentioning
confidence: 99%