Demonstration of a novel low cost single material temporary bond solution for high topography substrates based on a mechanical wafer debonding and innovative adhesive removal

Phommahaxay, Alain; Nakamura, Atsushi; Jourdain, Anne; Verbinnen, Greet; Kamochi, Yoshitaka; Koyama, Ichiro; Iwai, Yu; Sawano, M.; Tan, Shiro; Miller, Andy; Beyer, Gerald; Sleeckx, Erik; Beyne, Eric

doi:10.1109/ectc.2015.7159785

Cited by 5 publications

(1 citation statement)

References 8 publications

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“…TGA results showed that the material decomposes at 360 • C with 0.5% [60]. A via-middle integration flow with a 50 µm high Cu pillar has been demonstrated [51,79]. The adhesive is about 30 µm thick, while the wafer is thinned to 50 µm with a total thickness variation (TTV) value of about 2 µm in this progress.…”

Section: Mechanical Peel-offmentioning

confidence: 80%

Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications

Wang

et al. 2023

Electronics

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Temporary bonding/debonding (TBDB) technologies have greatly contributed to the reliable fabrication of thin devices. However, the rapid development of large-scale, high-precision and ultra-thin devices in the semiconductor field has also proposed more stringent requirements for TBDB technologies. Here, we deliberate the recent progress of materials for temporary bonding and different debonding technologies over the past decade. Several common debonding methods are described, including thermal slide, wet chemical dissolution, mechanical peeling and laser ablation. We review the current status of different debonding technologies and highlight the applications of TBDB technologies in advanced electronic packaging. Possible solutions are proposed for the challenges and opportunities faced by different TBDB technologies. Ultimately, we attempt to propose an outlook on their future development and more possible applications. We believe that the simple schematics and refined data presented in this review would give readers a deep understanding of TBDB technologies and their vast application scenarios in future advanced electronic packaging.

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Section: Mechanical Peel-offmentioning

confidence: 80%