Gallium nitride (GaN) is generally considered a good candidate for power electronic devices such as Schottky barrier diodes (SBDs). Nevertheless, GaN has a strong sensitivity to high temperature treatments and a cap-layer is mandatory to protect the material surface during annealing at high temperature such as post-implantation treatments. In this work, an oxidized gallium nitride layer (GaO x N y ) was generated with Oxford PECVD equipment using a N 2 O plasma treatment to protect the GaN surface during a rapid thermal annealing (RTA), in the range of 1000 °C-1150 °C for a few minutes. Before annealing, c-TLM patterns were processed on the GaO x N y /GaN sample to characterize its sheet resistance. After the N 2 O plasma treatment, the sample exhibited lower sheet resistance, indicating a better n-type conduction of the GaO x N y layer due to an excess of free carriers, compared to the as-grown GaN layer. The GaO x N y /GaN surface was then annealed at 1150 °C for 3 min and observed through AFM imaging. The surface exhibited a good quality with a low roughness, nevertheless, a low density of small hexagonal pits appeared after annealing. Finally, studies to determine an efficient etching process of the GaO x N y cap-layer were conducted using both chemical and physical approaches. We observed that efficient etching of the layer was achieved using a heated hydrofluoridric acid (HF 25%) solution. To conclude, GaO x N y has proved to be an efficient cap-layer for GaN protection at high temperature.