2013
DOI: 10.7567/jjap.52.08jb22
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Accumulation of Background Impurities in Hydride Vapor Phase Epitaxy Grown GaN Layers

Abstract: We report on accumulation of background Si and O impurities measured by secondary ion mass spectrometry (SIMS) at the sub-interfaces in undoped, Zn- and Mg-doped multi-layer GaN structures grown by hydride vapor phase epitaxy (HVPE) on sapphire substrates with growth interruptions. The impurities accumulation is attributed to reaction of ammonia with the rector quartz ware during the growth interruptions. Because of this effect, HVPE-grown GaN layers had excessive Si and O concentration on the surface that may… Show more

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Cited by 13 publications
(10 citation statements)
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“…In particular, the concentration of carbon, which creates deep-level defects, can be reduced down to 10 15  cm −3 (ref. 6), and the concentrations of oxygen and silicon (both acting as shallow donors in GaN) can be reduced down to 2 × 10 16 and 2 × 10 15  cm −3 , respectively789. All these values are at the detection limit of SIMS measurements.…”
mentioning
confidence: 91%
“…In particular, the concentration of carbon, which creates deep-level defects, can be reduced down to 10 15  cm −3 (ref. 6), and the concentrations of oxygen and silicon (both acting as shallow donors in GaN) can be reduced down to 2 × 10 16 and 2 × 10 15  cm −3 , respectively789. All these values are at the detection limit of SIMS measurements.…”
mentioning
confidence: 91%
“…It is known that oxygen can diffuse from the sapphire substrate to GaN via structural defects and create a thin, degenerate layer near the GaN/sapphire interface (Look et al, 2001). It is also established that Si tends to accumulate at surfaces and subinterfaces (caused by growth interruption) in GaN grown by HVPE (Usikov et al, 2013).…”
Section: Growth Methods and Sims Analysismentioning
confidence: 99%
“…The growth process was performed in argon ambient with metallic Ga as a source material and hydrogen chloride and ammonia as active gases. The growth was performed at temperatures of 850-950°C that were somewhat lower than in a typical HVPE process of 1020-1050°C (Usikov et al, 2013;Sato et al, 2013;Fujito et al, 2009;Liu et al, 2014;Paskova et al, 2010) the growth rate was 0.2-1 µm/min and the total thickness of the layers was 10-20 µm. The growth was initiated at low growth rate and then continued with increased growth rate.…”
Section: Methodsmentioning
confidence: 99%