2020
DOI: 10.1109/jphotov.2020.2964987
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Degradation and Regeneration of n +-Doped Poly-Si Surface Passivation on p-Type and n-Type Cz-Si Under Illumination and Dark Annealing

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Cited by 18 publications
(11 citation statements)
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“…[ 23,24 ] In contrast, annealing at 400 °C was found to improve both the passivation and subsequent stability of n‐type wafers with polysilicon/tunnel oxide passivation. [ 14 ] This suggests that the passivation scheme is important for the response to post‐firing annealing. Further work is required to determine what the critical parameters for this process might be.…”
Section: Discussionmentioning
confidence: 99%
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“…[ 23,24 ] In contrast, annealing at 400 °C was found to improve both the passivation and subsequent stability of n‐type wafers with polysilicon/tunnel oxide passivation. [ 14 ] This suggests that the passivation scheme is important for the response to post‐firing annealing. Further work is required to determine what the critical parameters for this process might be.…”
Section: Discussionmentioning
confidence: 99%
“…It has important implications for long‐term stability testing [ 12 ] and can reduce long‐term performance for certain solar cell architectures in the field. [ 13–15 ]…”
Section: Introductionmentioning
confidence: 99%
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“…[13][14][15] Additionally, several studies have also demonstrated a firinginduced degradation in the tunnelling oxide/doped polysilicon passivation scheme employed in TOPCon solar cells. 16,17 The incorporation of a hydrogenation step is critical to achieve the required chemical passivation for the tunnelling oxide, polysilicon contact. 18 The chemical passivation at the SiO 2 /c-Si interface is typically achieved by high-temperature annealing in the presence of a hydrogenated dielectric layer.…”
mentioning
confidence: 99%