Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints

Goh, Yingxin; Haseeb, A.S.M.A.; Liew, H.L.; Sabri, Mohd Faizul Mohd

doi:10.1007/s10853-015-8978-0

Cited by 31 publications

(20 citation statements)

References 22 publications

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“…11 shows the effect of variation in IMC volume fraction on ultimate shear strength and strain to failure (fracture strain) at 0.015s -1 and 0. [11,12,35]. These hard and brittle IMCs resist shearing at the beginning of plastic flow.…”

Section: Shear Stress-strain Properties and Effect Of Imc Thicknessmentioning

confidence: 99%

“…It has been shown that interfacial IMCs tend to have a major role in determining the reliability of solder joints due to their different mechanical properties [6][7][8][9]. Recently, IMC thickness effect on shear behavior of the solder joints has been explored in some studies [10][11][12][13][14][15][16]. Variation in IMC thickness were achieved by either varying the reflow temperature [11,12], or using isothermal aging [13][14][15].…”

Section: Introductionmentioning

confidence: 99%

“…Recently, IMC thickness effect on shear behavior of the solder joints has been explored in some studies [10][11][12][13][14][15][16]. Variation in IMC thickness were achieved by either varying the reflow temperature [11,12], or using isothermal aging [13][14][15]. Goh et al [11] has investigated the effect of reflow temperature on the shear strength of the Sn-Bi/Cu solder joints.…”

Section: Introductionmentioning

confidence: 99%

“…Variation in IMC thickness were achieved by either varying the reflow temperature [11,12], or using isothermal aging [13][14][15]. Goh et al [11] has investigated the effect of reflow temperature on the shear strength of the Sn-Bi/Cu solder joints. They observed an increase in ultimate shear strength with the increased reflow temperature (200°C to 260°C) while no effect on the elastic regime.…”

Section: Introductionmentioning

confidence: 99%

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Local shear stress-strain response of Sn-3.5Ag/Cu solder joint with high fraction of intermetallic compounds: Experimental analysis

Choudhury

Ladani

2016

Journal of Alloys and Compounds

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Current trend in miniaturization of microelectronic devices is the motivating factor for size reduction of joints and interconnects. The electronic industry is expecting to reduce the scale of interconnects in the next generations microelectronic devices. Mechanical behavior of these joints will significantly be different from traditional solder joints due to the effects such as geometrical and microstructural constraints, anisotropy caused by the reduction in a number of grains, and the presence of brittle intermetallics (IMCs). Mechanical experiments at this scale are very challenging. This study was focused on investigating the effect of different volume fraction of IMCs on the shear behavior of micro-scale solder joints with a 50µm stand-off height. A single lap-shear specimen was designed to conduct the study. Two Copper (Cu) substrates were soldered together with Sn-3.5Ag solder foil and a thickness of 50µm was achieved. The soldering temperature of 260°C and soldering time of 10, 30 and 60 minutes were utilized to achieve approximately 40%, 60% and 80% IMCs of total joint thickness. The experiments were conducted using a micro-tensile tester which is integrated with an optical microscope for monitoring and observing deformation in the testing materials. To investigate the local shear strain behavior, an optical technique along with a developed image processing computer program was used. The single lap-shear tests were conducted with the shear strain rate of 0.015s -1 and 0.15s -1 to observe

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Section: Shear Stress-strain Properties and Effect Of Imc Thicknessmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Local shear stress-strain response of Sn-3.5Ag/Cu solder joint with high fraction of intermetallic compounds: Experimental analysis

Choudhury

Ladani

2016

Journal of Alloys and Compounds

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“…Tin-bismuth alloys have been electrodeposited from different baths using direct-current and pulsed-current techniques [10][11][12][13][14][15][16][17][18][19][20][21][22][23][24][25]. The standard reduction potential of Bi 3+ is 444 mV nobler than that of Sn 2+ .…”

Section: Introductionmentioning

confidence: 99%

Electrodeposition of Tin-Bismuth Alloys: Additives, Morphologies and Compositions

Rajamani

Jothi

Datta

et al. 2018

J. Electrochem. Soc.

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Electrodeposition of tin-bismuth alloys on polycrystalline copper electrodes has been studied from an acidic bath comprising SnCl4, Bi(NO3)3, citric acid, poly(vinyl alcohol) and betaine. Using linear sweep voltammetry (LSV) and chronoamperometry (CA), co-deposition of tin and bismuth from the above bath has been examined. Bismuth (III) ions get reduced in a single-step, three-electron-transfer reaction while tin (IV) ions undergo a two-step reduction through the formation of tin (II) ions. Nitric acid in the bath not only enhances solubility of the precursors but also decreases the peak potential separation between bismuth (III) and tin (II) ions. Through the introduction of various additives and variation in bath pH, co-deposition is preserved while the composition of tin in the obtained alloy is modified. The morphologies, composition and crystallinity of the deposits have been determined using scanning electron microscopy, inductively coupled plasma atomic emission spectroscopy and X-ray diffraction, respectively. A wide range of alloy compositions (from 14% to 75% tin), including the eutectic Sn-Bi alloy have been deposited. Novel morphologies such as yarns-of-spool have been obtained.

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Enhanced shear strength of Cu–Sn intermetallic interconnects with interlocking dendrites under fluxless electric current-assisted bonding process

et al. 2016

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Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints

Cited by 31 publications

References 22 publications

Local shear stress-strain response of Sn-3.5Ag/Cu solder joint with high fraction of intermetallic compounds: Experimental analysis

Local shear stress-strain response of Sn-3.5Ag/Cu solder joint with high fraction of intermetallic compounds: Experimental analysis

Electrodeposition of Tin-Bismuth Alloys: Additives, Morphologies and Compositions

Enhanced shear strength of Cu–Sn intermetallic interconnects with interlocking dendrites under fluxless electric current-assisted bonding process

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