Electrodeposition of Tin-Bismuth Alloys: Additives, Morphologies and Compositions

Abstract

Electrodeposition of tin-bismuth alloys on polycrystalline copper electrodes has been studied from an acidic bath comprising SnCl4, Bi(NO3)3, citric acid, poly(vinyl alcohol) and betaine. Using linear sweep voltammetry (LSV) and chronoamperometry (CA), co-deposition of tin and bismuth from the above bath has been examined. Bismuth (III) ions get reduced in a single-step, three-electron-transfer reaction while tin (IV) ions undergo a two-step reduction through the formation of tin (II) ions. Nitric acid in the bath not only enhances solubility of the precursors but also decreases the peak potential separation between bismuth (III) and tin (II) ions. Through the introduction of various additives and variation in bath pH, co-deposition is preserved while the composition of tin in the obtained alloy is modified. The morphologies, composition and crystallinity of the deposits have been determined using scanning electron microscopy, inductively coupled plasma atomic emission spectroscopy and X-ray diffraction, respectively. A wide range of alloy compositions (from 14% to 75% tin), including the eutectic Sn-Bi alloy have been deposited. Novel morphologies such as yarns-of-spool have been obtained.

Controlling Horizontal Growth of Zinc Platelet by OP‐10 Additive for Dendrite‐Free Aqueous Zinc‐Ion Batteries

“…This behavior is called a super‐filling phenomenon and it has already been proposed [44] . A large number of zinc‐philic groups of OP‐10 increase the nucleation sites, which can homogenize Zn 2+ cations transport toward the electrode surface and hence, stabilizes the electrodeposition in a regime below a critical flux [36] . This change is beneficial to the deposition and growth of zinc in the direction parallel to the zinc foil, making the Zn (002) planes dominant and displaying a key role in inhibiting Zn dendrite growth [39] .…”

“…[44] A large number of zincphilic groups of OP-10 increase the nucleation sites, which can homogenize Zn 2 + cations transport toward the electrode surface and hence, stabilizes the electrodeposition in a regime below a critical flux. [36] This change is beneficial to the deposition and growth of zinc in the direction parallel to the zinc foil, making the Zn (002) planes dominant and displaying a key role in inhibiting Zn dendrite growth. [39] Concurrently, the adsorption of OP-10 on the Zn-foil surface also reduces the coordinated water molecules from direct contact with the electrode surface, thereby preventing the decomposition of water and other side reactions.…”

“…[33] Generally, small quantities of additive species will preferentially adsorb onto and accumulate near surface protrusions and thereby stabilize the electrodeposition in a regime below a critical flux. [35,36] Appropriate molecules for guiding Zn-crystal growth orientation are important. Herein, OP-10 (octenyl phenol polyoxyethylene ether-10, hereinafter referred to as OP-10), a common emulsifier, is used as the electrolyte additive of AZIBs for the first time.…”

“…Generally, small quantities of additive species will preferentially adsorb onto and accumulate near surface protrusions and thereby stabilize the electrodeposition in a regime below a critical flux [35,36] . Appropriate molecules for guiding Zn‐crystal growth orientation are important.…”

Electrodeposition of Bismuth in a Choline Chloride/Ethylene Glycol Deep Eutectic Solvent under Ambient Atmosphere

“…Electrodeposition of Bi films with various morphologies and particles from micrometer to nanometer has been intensively studied in acid containing aqueous electrolytes without and with additives. [4][5][6][7][8][9][10] Electrodeposition of Bi has also been studied in organic 11 and molten salts. 12 Recently, ionic liquids (ILs) that are liquid at temperature below 100 • C have been considered more advantageous than organic electrolytes and high temperature molten salts because ILs are nonflammable, non-volatile, high thermal stability, and have a relatively good conductivity, as well as wide electrochemical window.…”