Defects in Cu and Cu–O films produced by reactive magnetron sputtering

Magnetron Sputtered SnOxFilms on Tin Probed by Slow Positron Implantation Spectroscopy

“…It is difficult to judge if at these voltages we really do have "ideal" sputtering conditions. However, this finding is consistent with hints from earlier studies by conventional positron lifetime spectroscopy [13] which indicate a decrease in the concentration of vacancy clusters around -100 V bias.…”

“…This interpretation is supported from the results in Ref. [13] where the presence of a positron lifetime of about 400 ps in all films prepared at identical conditions (bias, oxygen partial pressure) implied the existence of defects like vacancy clusters. However, in this work no depth resolution was possible.…”

Positron Annihilation Spectroscopy Study on Annealing Effect of CuO Nanoparticles

“…We observe that a small increase of τ 1 , around 185 ps, is associated with positron trapping at vacancy-type defects in the two-grain interfaces, τ 2 increases from 308 to 360 ps due to positrons trapping at larger-size vacancy clusters in three-grain junctions 28 , while the decrease of I 2 may be due to a reduction in the number of three-grain junctions. The bulk lifetime of about 169 ps in CuO was fixed according to the previous PALS studies 29,35 . The value of τ 1 (~180 ps) is between the lifetime of positron annihilation in a bulk (169 ps) and a Cu mono-vacancy (230 ps) 29 .…”

Evolution of Principle and Practice of Electrodeposited Thin Film: A Review on Effect of Temperature and Sonication

“…The complexity of the tribological properties of materials and the economic aspects of friction and wear justify the increasing research effort in bridging the fields of ultrafine-structured materials and coatings. Thin films are coatings with the thickness value below 1 μm and are widely used in microelectronics, optics, and solar cell systems [11][12][13][14][15][16][17]. Thin film systems necessitate direct control of materials on the molecular and atomic scale, including surface modifications, deposition, and structuring.…”