Cutting Force Analysis of on-Machine Fabricated PCD Tool during Glass Micro-Grinding

Abstract

Brittle and hard materials are problematic to mechanically micro machine due to damage resulting from material removal by brittle fracture, cutting force-induced tool deflection or breakage and tool wear. As a result, the forces arising from the cutting process are important parameter for material removal. This study was undertaken to investigate the effect of cutting conditions on cutting forces and the machined surface during the glass micro grinding using on-machine fabricated (Poly Crystalline Diamond) PCD tool. Experimental results showed that an increase in depth of cut and feed rate can result in increase of cutting forces and surface roughness as well. Among the forces in 3 axes, force along feed direction is found to be larger, which played a major role in material removal. Finally, it is observed that PCD tool exhibits promising behaviour to machine brittle material like BK-7 glass for producing micro molds and micro fluidic devices, since it has better wear resistance, experiences less cutting forces and generates smooth surfaces with Ra value of as low as 12.79 nm.

Fabrication of different geometry cutting tools and their effect on the vertical micro-grinding of BK7 glass

“…Voltage and capacitance was set at 110 V and 1,000 pF during machining. As higher energy caused larger crater size and lower energy lengthen the machining time, we have selected some intermediate energy level for tool preparation [36]. Once one face of the triangle was prepared, and then next DE edge of triangular slot was used to fabricate another face.…”

Experimental Study of Tool Wear and Grinding Forces During BK-7 Glass Micro-grinding with Modified PCD Tool

“…At the machining time of 60 minute, there is a sudden rise in F x and F y values for tool type 2G. This is due to clogging of chips or re-sharpening of tool for any particular case [15]. Tool re-sharpening at any instant may lead to sharp cutting edges, which in turn increases the chip load and grinding forces.…”