On-machine texturing of PCD micro-tools for dry micro-slot grinding of BK7 glass

Pratap, Ashwani; Patra, Karali; D’yakonov, A. A.

doi:10.1016/j.precisioneng.2018.11.004

Cited by 36 publications

(6 citation statements)

References 33 publications

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“…The material removal method during the grinding process can be analyzed by the critical cutting depth hc and the undeformed chip thickness hm [29][30][31][32] . The undeformed chip thickness for vertical surface grinding can be obtained from the following equation [8,33,34] :…”

Section: Micro-scale Grinding Mechanism Of Ito Conductive Glassmentioning

confidence: 99%

Experimental investigations into the effect of process parameters on the machining quality for ITO conductive glass using by micro grooves grinding

Liu,

Qiu,

Sun

et al. 2023

Preprint

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To investigate the effect of micro-scale grinding on the quality of ITO conductive glass, this paper conducted micro-scale grinding experiments on ITO conductive glass. The influence of process parameters on machining quality was analyzed using micro-grinding force, surface roughness, and sheet resistance as indicators. Meanwhile, soda-lime glass was set as the control group to analyze the effect of ITO film. The results indicate that brittle fracture is the main removal method for ITO films, and the glass substrate exhibits two different removal methods, brittle and ductile, depending on the process parameters. The ITO thin film layer suppresses the sheet deformation of the glass substrate, increasing the grinding force and reducing the processing quality. Increasing the spindle speed, reducing the feed speed, and reducing the cutting depth can improve the machining quality. The spindle speed has a significant impact on surface roughness, while the cutting depth has a significant impact on the sheet resistance of the thin film. In addition, soda-lime glass chips mainly appear in powder and granular form, while ITO conductive glass also has flaky thin film chips generated by interlayer fracture.

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Section: Micro-scale Grinding Mechanism Of Ito Conductive Glassmentioning

confidence: 99%

Experimental investigations into the effect of process parameters on the machining quality for ITO conductive glass using by micro grooves grinding

Liu,

Qiu,

Sun

et al. 2023

Preprint

View full text Add to dashboard Cite

show abstract

“…A smooth fused silica surface without any micro-cracks can be generated through the ductile mode grinding when the feed speed and the grinding depth are 10 µm and 1 mm/min, respectively [14]. During single/parallel micro-slot grinding of BK7 glass, two critical steps of undeformed chip thickness for the transition from ductile to ductilebrittle mode and for the transition from ductile-brittle to brittle mode are instituted to be 15.72 nm and 29.80 nm, respectively [15,16]. However, the ductile mode grinding parameters for some optical glasses are impossible to be used in the practical fabricating process for its extremely low material removal efficiency.…”

Section: Introductionmentioning

confidence: 99%

Mechanism analysis and modelling of surface roughness for CeO2 slurry assisted grinding of BK7 optics considering both particle size and mass fraction

Zhang¹,

Yao

Li³

et al. 2022

Preprint

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Prolonged polishing deteriorates the shape accuracy of an optical element and reduces production efficiency simultaneously. In order to reduce the amount of polishing and polishing time, even obtain polish-free fine surfaces, a cerium oxide (CeO2) slurry assisted grinding (SAG) is investigated. A novel theoretical model was established to predict the surface roughness of the workpiece processed by CeO2 SAG. The modelling considered the effects of the protrusion height of active grains in the grinding wheel and the sizes and mass fractions of CeO2 particles in the grinding zone on undeformed chip thickness (UCT). Then, the mechanism of CeO2 SAG was investigated through nanoindentation method. Indentation hardness and energy spectrum of the surface were estimated to verify the softened layer. The results showed that the model of surface roughness was well consistent with the experiment. The CeO2 particle size significantly influenced on the surface roughness than the mass fraction. The load-bearing effect of larger CeO2 particle size reduced the protruding height of the grinding wheel grains and reduced the UCT to a greater extent in grinding process. The chemical reaction between CeO2 slurry and BK7 glass results in a softening layer which enhances the critical load and critical depth of ductile-brittle transition of grinding. Finally, the optimized parameters were used for CeO2 SAG of an ellipsoid BK7 optics.

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“…Textured grinding tools possess merits of low grinding temperature, transport channel for liquid coolant that can improve the lubricating and cooling during grinding, and also reducing grinding forces [9][10][11][12][13] .…”

Section: Introductionmentioning

confidence: 99%

Optimization for Morphology of Grinding Layer on Textured Laser Cladding Grinding Tool

Zhao

2021

Preprint

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In order to improving the grinding performance of laser cladding textured grinding tool (LCTGT) under high speed grinding process, the topography shape (height, width and height/width ratio) of laser cladding grinding layers on LCTGT were designed with RSM (response surface method) through optimizing laser cladding processing parameters and laser cladding layers structure parameters that based on Archimedes helix coefficients. The LCTGTs were produced with optimized laser cladding parameters and structural parameters for laser cladding grinding layers. The results showed that laser cladding parameters of 397W of laser power, 3.56 mm/s of the laser scanning speed and 0.91 r/min of powder feeding rate and structure parameters of laser cladding layers of 6-10-10 can meet requirement.

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On-machine texturing of PCD micro-tools for dry micro-slot grinding of BK7 glass

Cited by 36 publications

References 33 publications

Experimental investigations into the effect of process parameters on the machining quality for ITO conductive glass using by micro grooves grinding

Experimental investigations into the effect of process parameters on the machining quality for ITO conductive glass using by micro grooves grinding

Mechanism analysis and modelling of surface roughness for CeO2 slurry assisted grinding of BK7 optics considering both particle size and mass fraction

Optimization for Morphology of Grinding Layer on Textured Laser Cladding Grinding Tool

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