2009
DOI: 10.1016/j.sse.2009.03.013
|View full text |Cite
|
Sign up to set email alerts
|

Current transport of GaAsSb-based DHBTs with different emitter structures

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1

Citation Types

0
2
0

Year Published

2012
2012
2015
2015

Publication Types

Select...
3
2

Relationship

0
5

Authors

Journals

citations
Cited by 5 publications
(2 citation statements)
references
References 11 publications
0
2
0
Order By: Relevance
“…As InGaAs is an alloy, its dielectric constant is calculated using linear interpolation between the corresponding parameters of GaAs and InAs [13,14].The compressive strain developed in In x Ga 1-x As channel grown on InP substrate and InAlAs buffer is considered while calculating band parameters such as band gap and conduction and valence band offsets [12]. In addition, the reported values [15,16,17] of the dielectric constant and the band gap of the substrate InP and buffer material InAlAs are used in our investigation. While simulating CMOS devices at channel lengths 30 nm and 20 nm, the EOT of the devices are chosen 1 nm and 0.8 nm, respectively following the International Technology Roadmap for Semiconductors (ITRS) [18].…”
Section: Device Structure and Simulation Set-upmentioning
confidence: 99%
“…As InGaAs is an alloy, its dielectric constant is calculated using linear interpolation between the corresponding parameters of GaAs and InAs [13,14].The compressive strain developed in In x Ga 1-x As channel grown on InP substrate and InAlAs buffer is considered while calculating band parameters such as band gap and conduction and valence band offsets [12]. In addition, the reported values [15,16,17] of the dielectric constant and the band gap of the substrate InP and buffer material InAlAs are used in our investigation. While simulating CMOS devices at channel lengths 30 nm and 20 nm, the EOT of the devices are chosen 1 nm and 0.8 nm, respectively following the International Technology Roadmap for Semiconductors (ITRS) [18].…”
Section: Device Structure and Simulation Set-upmentioning
confidence: 99%
“…The intrinsic carrier concentration of 9×10 11 cm -3 for InGaAs [9] has been used in our study. Also the reported values of the dielectric constant and band gap of the barrier materials InP and InAlAs [11] are used in our studies. Earlier experimental findings revealed that the highk/InGaAs interface contained appreciable amount of D it in the range 1×10 12 2 shows a comparison of the simulated device characteristics with the experimental curves as reported in [2] for InGaAs channel n-MOSFETs with different architectures  no barrier, single barrier and double barriers.…”
Section: Introductionmentioning
confidence: 99%