Curing and thermal properties of copolymer epoxy resins prepared by copolymerized bisphenol-A and epichlorohydrin with liquefied Dendrocalamus latiflorus

Abstract

Dendrocalamus latiflorus Munro (ma bamboo) was liquefied in phenol or in polyethylene glycol/glycerol cosolvent, with H 2 SO 4 as a catalyst. The liquefied bamboo was reacted with bisphenol-A and epichlorohydrin to prepare copolymer epoxy resins. The thermal properties of resins during and after curing were investigated by differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA). The results showed that a novel epoxy resin can be prepared by copolymerizing liquefied bamboo with bisphenol-A and epichlorohydrin in a two-step process. DSC analysis showed that the copolymer epoxy resins prepared with phenol-liquefied bamboo had a curing behavior similar to that of neat epoxy resin, even when 50% of the bisphenol-A was replaced with liquefied bamboo. However, the reactivity of copolymer epoxy resins prepared with polyhydric alcohol-liquefied bamboo decreased as the substitution amount of liquefied bamboo increased. DMA showed that the storage modulus and tan d of cured copolymer epoxy resins decreased as the amount of substituted liquefied bamboo increased.

Investigating the use of peanut meal: a potential new resource for wood adhesives

“…15 Incorporating EGDE dramatically decreased the initial viscosity of the adhesive by 95.8%, from 569 200 to 24 140 mPa s, because the viscosity of EGDE is very low and the material has small molecular substancethese qualities lubricate protein molecules so that EGDE acts as a disperser, distributed throughout the PM to decrease the viscosity of the resultant adhesive. 22 Compared to adhesive C, the viscosity of adhesive D was decreased by 41.9% from 24 140 to 14 030 mPa s. The result further proofed that the use of SDS improved the viscosity in this experiment.…”

Soybean meal-based wood adhesive enhanced by ethylene glycol diglycidyl ether and diethylenetriamine

“…When introducing SDS, the initial viscosity of the adhesive B increased by 21.8% from 36,980 to 45,040 mPa s. The SDS could swell and unfold the protein molecules and decrease of the distance between protein molecules, which increased the viscosity of the adhesive (Mo et al, 2004). The incorporation of EGDE dramatically decreased the initial viscosity of the adhesive C by 68% from 45,040 to 14,410 mPa s. This was because EGDE, which was a small molecular substance, could distribute in SM as a molecule lubricant to decrease the viscosity of the adhesive (Wu and Lee, 2010). When adding EGDE/DETA, the initial viscosity of the adhesive D (22,400 mPa s) rose slightly, which was attributed to the elevated molecule chain increased the viscosity and reduced the lubrication effect of EGDE/DETA.…”

Wood-Based Epoxy Resin's Synthesis Using Decayed Woody Material from Mushroom Cultivation

“…Epoxy resin is one of the most important functional polymers that are being used in various applications, but the poor thermal properties limit its applications. There are many studies [11,19] to enhance the thermal properties of epoxy resin. Fujiwara et al [11] synthesized epoxy resins containing various amount of woody sample and material decreased as the increase of the amount of the woody sample.…”